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1-5 of 5
Carlos Da Silva
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Journal Articles
Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041102.
Paper No: EP-20-1020
Published Online: June 4, 2020
Proceedings Papers
Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
Proceedings Papers
Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A002, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50675
Proceedings Papers
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A026, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50678
Proceedings Papers
Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A004, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-37326