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Proceedings Papers

Thermal Analysis of a Laser Peeling Technique for Removing Micro Edge Cracks of Ultrathin Glass Substrates for Web Processing

Tian-Shiang Yang, Guang-Di Chen, Kuo-Shen Chen, Rong-Can Hong, Tz-Cheng Chiu, Chang-Da Wen, Chun-Han Li, Chien-Jung Huang, Kun-Tso Chen, Mao-Chi Lin
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A021, November 13–19, 2015
Paper No: IMECE2015-50316
https://doi.org/10.1115/IMECE2015-50316
View Paper titled, Thermal Analysis of a Laser Peeling Technique for Removing Micro Edge Cracks of Ultrathin Glass Substrates for Web Processing
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Topics: Fracture (Materials), Glass, Lasers, Thermal analysis, Finite element methods, Carbon dioxide lasers, Computer software, Cooling, Cracking (Materials), Flexible electronics