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Proceedings Papers

Hydraulic Efficiency Conversion From a Model to Prototype Pump Based on Effects of Reynolds Number and Surface Roughness

Hiroaki Yoda, Kazuo Uranishi, Masao Oshima, Takaki Sakurai, Daichi Torii, Masahiro Miyabe, Kazuta Kobayashi, Masashi Ikezawa
Proc. ASME. FEDSM2016, Volume 1A, Symposia: Turbomachinery Flow Simulation and Optimization; Applications in CFD; Bio-Inspired and Bio-Medical Fluid Mechanics; CFD Verification and Validation; Development and Applications of Immersed Boundary Methods; DNS, LES and Hybrid RANS/LES Methods; Fluid Machinery; Fluid-Structure Interaction and Flow-Induced Noise in Industrial Applications; Flow Applications in Aerospace; Active Fluid Dynamics and Flow Control — Theory, Experiments and Implementation, V01AT09A013, July 10–14, 2016
Paper No: FEDSM2016-7780
https://doi.org/10.1115/FEDSM2016-7780
View Paper titled, Hydraulic Efficiency Conversion From a Model to Prototype Pump Based on Effects of Reynolds Number and Surface Roughness
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Topics: Engineering prototypes, Pumps, Reynolds number, Surface roughness, Flow (Dynamics), Friction, Computational fluid dynamics, Flat plates, Impellers, Sands
Journal Articles

Molecular-Scale Mechanism of Thermal Resistance at the Solid-Liquid Interfaces: Influence of Interaction Parameters Between Solid and Liquid Molecules

Daichi Torii, Taku Ohara, Kenji Ishida
Journal: Journal of Heat Transfer
Article Type: Research Papers
J. Heat Transfer. January 2010, 132(1): 012402.
https://doi.org/10.1115/1.3211856
Published Online: October 23, 2009
View Article titled, Molecular-Scale Mechanism of Thermal Resistance at the Solid-Liquid Interfaces: Influence of Interaction Parameters Between Solid and Liquid Molecules
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Topics: Density, Liquid films, Molecular dynamics simulation, Temperature, Thermal resistance, Thermal energy, Degrees of freedom, Simulation, Interfacial thermal resistance, Equilibrium (Physics)
Proceedings Papers

Molecular Scale Mechanism of Thermal Resistance at Solid-Liquid Interfaces (Influence of Interaction Parameters Between Solid and Liquid Molecules)

Daichi Torii, Taku Ohara, Kenji Ishida
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 23-31, July 8–12, 2007
Paper No: HT2007-32391
https://doi.org/10.1115/HT2007-32391
View Paper titled, Molecular Scale Mechanism of Thermal Resistance at Solid-Liquid Interfaces (Influence of Interaction Parameters Between Solid and Liquid Molecules)
Open the PDF for Molecular Scale Mechanism of Thermal Resistance at Solid-Liquid Interfaces (Influence of Interaction Parameters Between Solid and Liquid Molecules) in another window
Topics: Thermal resistance, Thermal energy, Liquid films, Heat conduction, Molecular dynamics simulation, Temperature