1-2 of 2
David Leslie
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022
Paper No: IPACK2022-97363
DOI: https://doi.org/10.1115/IPACK2022-97363
View Paper titled, Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods
Click here to open pdf in another window PDF for Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods
Topics: Creep, Silver
Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Paper No: IPACK2021-73197
DOI: https://doi.org/10.1115/IPACK2021-73197
View Paper titled, Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
Click here to open pdf in another window PDF for Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature