1-5 of 5
Dhananjay Panchagade
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Prognostication and Health Monitoring of Electronics in Implantable Biological Systems

Pradeep Lall, Prashant Gupta, Manish Kulkarni, Dhananjay Panchagade, Jeff Suhling, James Hofmeister
Proc. ASME. IMECE2008, Volume 2: Biomedical and Biotechnology Engineering, 657-671, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68275
https://doi.org/10.1115/IMECE2008-68275
View Paper titled, Prognostication and Health Monitoring of Electronics in Implantable Biological Systems
Open the PDF for Prognostication and Health Monitoring of Electronics in Implantable Biological Systems in another window
Topics: Electronics, Failure, Damage, Flaw detection, Shock (Mechanics), Solders, Electronic equipment, Electronic systems, Signals, Stress
Proceedings Papers

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1545-1556, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73427
https://doi.org/10.1115/IPACK2005-73427
View Paper titled, Models for Shock and Vibration Survivability of Electronic and MEMS Packaging
Open the PDF for Models for Shock and Vibration Survivability of Electronic and MEMS Packaging in another window
Topics: MEMS packaging, Shock (Mechanics), Vibration, Damage, Failure, Design, Electronic packaging, Reliability, Transients (Dynamics), Boundary-value problems
Proceedings Papers

Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-433, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62317
https://doi.org/10.1115/IMECE2004-62317
View Paper titled, Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact
Open the PDF for Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact in another window
Topics: Ball-Grid-Array packaging, Data acquisition systems, Deformation, Dynamics (Mechanics), Electronic products, Errors, Failure, Finite element model, Kinematics, Modeling
Proceedings Papers

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 155-166, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82612
https://doi.org/10.1115/IMECE2005-82612
View Paper titled, Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging
Open the PDF for Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging in another window
Topics: Failure, MEMS packaging, Shock (Mechanics), Vibration, Damage, Design, Electronic packaging, Reliability, Transients (Dynamics), Boundary-value problems
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
Open the PDF for Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages in another window
Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling