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Proceedings Papers

High pH Crack Growth Sensitivity to Underload-Type of Pressure Fluctuations

Hamid Niazi, Hao Zhang, Kaitlyn Korol, Weixing Chen
Proc. ASME. IPC2018, Volume 1: Pipeline and Facilities Integrity, V001T03A064, September 24–28, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPC2018-78394
https://doi.org/10.1115/IPC2018-78394
View Paper titled, High pH Crack Growth Sensitivity to Underload-Type of Pressure Fluctuations
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Topics: Fluctuations (Physics), Fracture (Materials), Pressure, Cycles, Pipelines, Stress, Compressors, Pumps, Steel, Cathodic protection
Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74232
https://doi.org/10.1115/IPACK2017-74232
View Paper titled, Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
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Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper
Proceedings Papers

Corrosion Behavior of X70 Pipeline Steel and Corrosion Rate Prediction Under the Combination of Corrosive Medium and Applied Pressure

Kaikai Li, Wei Wu, Guangxu Cheng, Yun Li, Haijun Hu, Hao Zhang
Proc. ASME. PVP2017, Volume 1B: Codes and Standards, V01BT01A036, July 16–20, 2017
Publisher: American Society of Mechanical Engineers
Paper No: PVP2017-65651
https://doi.org/10.1115/PVP2017-65651
View Paper titled, Corrosion Behavior of X70 Pipeline Steel and Corrosion Rate Prediction Under the Combination of Corrosive Medium and Applied Pressure
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Topics: Corrosion, Pipelines, Pressure, Steel, Carbon dioxide, Tension, Electrochemical impedance spectroscopy, Polarization (Electricity), Polarization (Light), Polarization (Waves)
Proceedings Papers

The Effects of Pressure Fluctuations on Hydrogen Embrittlement in Pipeline Steels

Xiao Xing, Mengshan Yu, Olayinka Tehinse, Weixing Chen, Hao Zhang
Proc. ASME. IPC2016, Volume 1: Pipelines and Facilities Integrity, V001T03A025, September 26–30, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IPC2016-64478
https://doi.org/10.1115/IPC2016-64478
View Paper titled, The Effects of Pressure Fluctuations on Hydrogen Embrittlement in Pipeline Steels
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Topics: Fluctuations (Physics), Hydrogen embrittlement, Pipelines, Pressure, Steel, Hydrogen, Stress, Crack propagation, Fracture (Materials), Temperature
Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48724
https://doi.org/10.1115/IPACK2015-48724
View Paper titled, Prognostics Health Management Model for LED Package Failure Under Contaminated Environment
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Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability
Proceedings Papers

Stainless Steel Tank Failure Analysis and Nondestructive Evaluation

Mingda Song, Huaixiang Cao, Xiaomin Shen, Xue Song, Hao Zhang
Proc. ASME. PVP2014, Volume 5: High-Pressure Technology; ASME NDE Division; 22nd Scavuzzo Student Paper Symposium and Competition, V005T10A006, July 20–24, 2014
Publisher: American Society of Mechanical Engineers
Paper No: PVP2014-28475
https://doi.org/10.1115/PVP2014-28475
View Paper titled, Stainless Steel Tank Failure Analysis and Nondestructive Evaluation
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Topics: Failure analysis, Nondestructive evaluation, Stainless steel, Fracture (Materials), Metals, Stress, Testing, Deformation, Emission spectroscopy, Failure
Proceedings Papers

Failure Analysis of CO Shift Gas Heat Exchanger Tubes

Huaixiang Cao, Hao Zhang, Mingda Song, Xiaomin Shen
Proc. ASME. PVP2014, Volume 6A: Materials and Fabrication, V06AT06A081, July 20–24, 2014
Publisher: American Society of Mechanical Engineers
Paper No: PVP2014-28594
https://doi.org/10.1115/PVP2014-28594
View Paper titled, Failure Analysis of CO Shift Gas Heat Exchanger Tubes
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Topics: Failure analysis, Heat exchangers, Corrosion, Leakage, Pressure, Temperature, Condensed matter, Scanning electron microscopy, Stress corrosion cracking, Vapors
Proceedings Papers

Manufacturing Scheduling for Energy Cost Reduction in a Smart Grid Scenario

Hao Zhang, Fu Zhao, John W. Sutherland
Proc. ASME. MSEC2014, Volume 1: Materials; Micro and Nano Technologies; Properties, Applications and Systems; Sustainable Manufacturing, V001T05A001, June 9–13, 2014
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2014-3926
https://doi.org/10.1115/MSEC2014-3926
View Paper titled, Manufacturing Scheduling for Energy Cost Reduction in a Smart Grid Scenario
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Topics: Manufacturing, Smart grids, Structures, Algebra, Flow (Dynamics), Integer programming, Modeling, Production facilities, Simulation results
Proceedings Papers

LED Lumen Degradation and Remaining Life Under Exposure to Temperature and Humidity

Pradeep Lall, Hao Zhang
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A076, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66832
https://doi.org/10.1115/IMECE2013-66832
View Paper titled, LED Lumen Degradation and Remaining Life Under Exposure to Temperature and Humidity
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Topics: Filters, Light-emitting diodes, Particulate matter, Temperature, Failure, Service life (Equipment), Cooling, Data acquisition systems, Errors, Failure mechanisms
Proceedings Papers

Passive Split Ring Resonator for Continuous Physiological Sensing Through Conductivity Measurements

Evan Baker, Noah Shaw, Chen Wang, Hao Zhang, Cheng Sun
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A008, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66744
https://doi.org/10.1115/IMECE2013-66744
View Paper titled, Passive Split Ring Resonator for Continuous Physiological Sensing Through Conductivity Measurements
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Topics: Electrical conductivity, Physiology, Thermal conductivity, Biocompatibility, Coating processes, Coatings, Q-factor, Resonance, Sensors, Biomedicine
Proceedings Papers

A Chemo-Mechanical Constitutive Model for Conducting Polymers

Vinithra Venugopal, Hao Zhang, Vishnu-Baba Sundaresan
Proc. ASME. SMASIS2013, Volume 2: Mechanics and Behavior of Active Materials; Structural Health Monitoring; Bioinspired Smart Materials and Systems; Energy Harvesting, V002T06A021, September 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2013-3218
https://doi.org/10.1115/SMASIS2013-3218
View Paper titled, A Chemo-Mechanical Constitutive Model for Conducting Polymers
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Topics: Conducting polymers, Constitutive equations, Polymers, Actuators, Electrolytes, Design, Electric fields, Relaxation (Physics), Cantilevers, Dynamic models
Proceedings Papers

Electromagnetic Compatibility Between DCS and Switchboard

Hao Zhang, Yousheng Hou, Junxia Che, Liqiang Zhang, Tao Jiang, Chuangbin Zhou
Proc. ASME. ICONE21, Volume 1: Plant Operations, Maintenance, Engineering, Modifications, Life Cycle and Balance of Plant; Nuclear Fuel and Materials; Radiation Protection and Nuclear Technology Applications, V001T01A002, July 29–August 2, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICONE21-15008
https://doi.org/10.1115/ICONE21-15008
View Paper titled, Electromagnetic Compatibility Between DCS and Switchboard
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Topics: China, Control systems, Electromagnetic compatibility, Electromagnetic pulse, Failure, Nuclear power stations, Safety
Proceedings Papers

Verification of Accumulator Model in COSINE

Huie Sha, Hao Zhang, Zheng Du, Yiqiang Xiong, Yanhua Yang
Proc. ASME. ICONE21, Volume 4: Thermal Hydraulics, V004T09A053, July 29–August 2, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICONE21-15639
https://doi.org/10.1115/ICONE21-15639
View Paper titled, Verification of Accumulator Model in COSINE
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Topics: Secondary cells, Computer software, Cores (Molding materials), Design, Engines, Flow (Dynamics), Friction, Gravity (Force), Inertia (Mechanics), Nitrogen
Proceedings Papers

Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73305
https://doi.org/10.1115/IPACK2013-73305
View Paper titled, Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter
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Topics: Filters, Light-emitting diodes, Particulate matter
Proceedings Papers

Effects of Stress on Pitting Corrosion Behavior of Low-Carbon Steel

Huaixiang Cao, Hao Zhang, Xingqi Qiu
Proc. ASME. PVP2013, Volume 6A: Materials and Fabrication, V06AT06A082, July 14–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: PVP2013-97127
https://doi.org/10.1115/PVP2013-97127
View Paper titled, Effects of Stress on Pitting Corrosion Behavior of Low-Carbon Steel
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Topics: Carbon, Corrosion, Steel, Stress, Carbon steel, Grain boundaries, Pressure, Pressure vessels, Safety, Scanning electron microscopes
Proceedings Papers

A Microlens Array on Curved Substrates by 3D Micro Projection and Reflow Process

Hao Zhang, Lei Li, David L. McCray, Donggang Yao, Allen Y. Yi
Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 995-999, June 4–8, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2012-7409
https://doi.org/10.1115/MSEC2012-7409
View Paper titled, A Microlens Array on Curved Substrates by 3D Micro Projection and Reflow Process
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Topics: Aluminum, Cylinders, Film thickness, Heating, Interferometers, Manufacturing, Particle spin, Photoresists, Rotation, Shapes
Proceedings Papers

Polypyrrole Bridge as a Support for Alamethicin-Reconstituted Planar Bilayer Lipid Membranes

Robert Northcutt, Vishnu-Baba Sundaresan, Sergio Salinas, Hao Zhang
Proc. ASME. SMASIS2011, ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 613-620, September 18–21, 2011
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2011-5015
https://doi.org/10.1115/SMASIS2011-5015
View Paper titled, Polypyrrole Bridge as a Support for Alamethicin-Reconstituted Planar Bilayer Lipid Membranes
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Topics: Bridges (Structures), Membranes, Conducting polymers, Manufacturing, Polymers, Proteins, Active materials, Actuators, Electrochemical impedance spectroscopy, Electrochemical reactions
Proceedings Papers

Electrochemical Analysis of Alamethicin Reconstituted Planar Bilayer Lipid Membranes Supported on Polypyrrole Membranes

Hao Zhang, Vishnu Baba Sundaresan, Sergio Salinas, Robert Northcutt
Proc. ASME. SMASIS2011, ASME 2011 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 629-635, September 18–21, 2011
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2011-5038
https://doi.org/10.1115/SMASIS2011-5038
View Paper titled, Electrochemical Analysis of Alamethicin Reconstituted Planar Bilayer Lipid Membranes Supported on Polypyrrole Membranes
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Topics: Electrochemical analysis, Membranes, Cell membranes, Conducting polymers, Electrical conductance, Energy conversion, Manufacturing, Proteins, Capacitance, Electric fields
Proceedings Papers

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

Gary Lehmann, Hao Zhang, Arun Gowda, David Esler
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 503-509, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73380
https://doi.org/10.1115/IPACK2005-73380
View Paper titled, Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials
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Topics: Composite materials, Particle size, Thermal conductivity, Thermal resistance, Particulate matter, Electrical conductance, Adhesives, Lasers, Manufacturing, Modeling