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Proceedings Papers

Hybrid Analytical and Experimental Method for Characterization of Thin Multilayer Bonded Structures Subject to Thermal Loading

Alireza Shirazi, Hua Lu, Ahmad Varvani
Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A018, June 18–22, 2018
Paper No: MSEC2018-6309
DOI: https://doi.org/10.1115/MSEC2018-6309
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Topics: Bonding, Bulk solids, Constitutive equations, Deformation, Design, Manufacturing, Materials properties, Mechanical properties, Plates (structures), Shades and shadows
Proceedings Papers

Fatigue Behaviour of Lead-Free Solder Interconnections in Life Prediction of Trilayer Structures Subjected to Thermal Cycling

Alireza Shirazi, Hua Lu, Ahmad Varvani-Farahani
Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A022, June 8–12, 2015
Paper No: MSEC2015-9250
DOI: https://doi.org/10.1115/MSEC2015-9250
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Topics: Fatigue, Lead-free solders, Fatigue damage, Fatigue life, Solder joints, Alloys, Adhesives, Ball-Grid-Array packaging, Cycles, Damage
Proceedings Papers

Aerodynamic Research on Highload Axial Compressor With a Chordwise Split

Zhi-Gang Zhang, Ping-Cheng Shen, Hong Zhu, Jia-Hua Lu, Yan-Sheng Li
Proc. ASME. GT1989, Volume 1: Turbomachinery, V001T01A004, June 4–8, 1989
Paper No: 89-GT-11
DOI: https://doi.org/10.1115/89-GT-11
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Topics: Compressors, Cascades (Fluid dynamics), Boundary layers, Flow (Dynamics), Pressure, Separation (Technology), Blades, Delays, Finite element methods, Flow turning
Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021009.
Paper No: EP-12-1043
DOI: https://doi.org/10.1115/1.4024056
Published Online: April 12, 2013
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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure
Journal Articles

Analysis and Modeling of a Pneumatic Servo System Based on Backstepping Design

Chia-Hua Lu, Ph.D., Yean-Ren Hwang, Yu-Ta Shen, Ph.D., Tzu-Yu Wang
Journal: Journal of Dynamic Systems, Measurement, and Control
Article Type: Research Papers
J. Dyn. Sys., Meas., Control. November 2011, 133(6): 061013.
DOI: https://doi.org/10.1115/1.4004601
Published Online: November 11, 2011
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Topics: Control equipment, Design, Engines, Errors, Motors, Servomechanisms, Trajectories (Physics), Control systems, Modeling, Pneumatic systems
eBook Chapter

Constrained Spectrum Denoising Based on Sparse Representation

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859926
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Topics: Errors, Noise (Sound), Signal to noise ratio, Signals, Simulation results, Wavelets
Proceedings Papers

Modelling Reliability of Power Electronics Packaging

Chris Bailey, Hua Lu, Chunyan Yin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 215-220, July 19–23, 2009
Paper No: InterPACK2009-89430
DOI: https://doi.org/10.1115/InterPACK2009-89430
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Topics: Electronic packaging, Modeling, Reliability, Electronics, Semiconductors (Materials), Aluminum, Design, Electric vehicles, Electricity (Physics), Energy management
Proceedings Papers

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

Chunyan Yin, Hua Lu, Chris Bailey, Yan-Cheong Chan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1293-1298, July 17–22, 2005
Paper No: IPACK2005-73367
DOI: https://doi.org/10.1115/IPACK2005-73367
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Topics: Anisotropy, Flip-chip, Flip-chip devices, Reliability, Adhesives, Modeling, Contact resistance, Diffusion (Physics), Epoxy adhesives, Epoxy resins
Proceedings Papers

Modelling the Performance of Lead-Free Solder Interconnects for Copper Bumped Flip-Chip Devices

Hua Lu, Chris Bailey
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 605-610, July 6–11, 2003
Paper No: IPACK2003-35356
DOI: https://doi.org/10.1115/IPACK2003-35356
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Topics: Copper, Flip-chip devices, Lead-free solders, Modeling, Reliability
Journal Articles

Reliability Analysis of Flip Chip Designs Via Computer Simulation

Hua Lu, C. Bailey, M. Cross
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 214–219.
DOI: https://doi.org/10.1115/1.1286122
Published Online: January 17, 2000
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Topics: Computer simulation, Fatigue, Flip-chip, Flip-chip devices, Geometry, Materials properties, Reliability, Solder joints, Solders, Young's modulus
Journal Articles

Photoelastic Determination of Stress Intensity Factor of an Interfacial Crack in a Bi-material

Hua Lu, F. P. Chiang
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. March 1993, 60(1): 93–100.
DOI: https://doi.org/10.1115/1.2900785
Published Online: March 1, 1993
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Topics: Fracture (Materials), Stress, Phase transitions, Tension