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Journal Articles

Production Behavior Evaluation on Inclined Well in Commingled Carbonate Gas Reservoir With Multiple Heterogeneous Layers Without Crossflow

Fankun Meng, Haijun Yan, Dongbo He, Xiaohua Liu, Qian Li, Hui Deng
Journal: Journal of Energy Resources Technology
Publisher: ASME
Article Type: Research Papers
J. Energy Resour. Technol. December 2022, 144(12): 123004.
Paper No: JERT-21-1811
https://doi.org/10.1115/1.4054173
Published Online: May 23, 2022
View Article titled, Production Behavior Evaluation on Inclined Well in Commingled Carbonate Gas Reservoir With Multiple Heterogeneous Layers Without Crossflow
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Topics: Permeability, Pressure, Reservoirs, Wells, Anisotropy, Fracture (Process)
Proceedings Papers

A New Efficient Algorithm of Finding Optimum Code Based on Incident Degree

Zhao-Hui Deng, Yu-Feng Luo, Zheng Xu
Proc. ASME. DETC98, Volume 1B: 25th Biennial Mechanisms Conference, V01BT01A078, September 13–16, 1998
Publisher: American Society of Mechanical Engineers
Paper No: DETC98/MECH-5933
https://doi.org/10.1115/DETC98/MECH-5933
View Paper titled, A New Efficient Algorithm of Finding Optimum Code Based on Incident Degree
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Topics: Algorithms, Kinematic chains
Journal Articles

A Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching

Weijia Guo, Senthil Kumar Anantharajan, Xinquan Zhang, Hui Deng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2020, 8(2): 024501.
Paper No: JMNM-19-1045
https://doi.org/10.1115/1.4046377
Published Online: March 27, 2020
View Article titled, A Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching
Open the PDF for A Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching in another window
Topics: Atmospheric pressure, Crystals, Damage, Etching, Plasma etching, Plasmas (Ionized gases), Semiconductor wafers, Silicon, Surface roughness