1-11 of 11
I. Dutta
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging

Z. Huang, I. Dutta, G. S. Subbarayan
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A003, July 16–18, 2013
Paper No: IPACK2013-73079
DOI: https://doi.org/10.1115/IPACK2013-73079
View Paper
PDF
Topics: Fracture (Materials), Fracture (Process), Solders, Tin, Brittleness, Fracture mechanics, Fracture toughness, Solder joints, Adhesives, Ball-Grid-Array packaging
Proceedings Papers

Effect of Aging on Impression Creep Behavior of Pb-Free Solders

B. Talebanpour, U. Sahaym, I. Dutta, P. Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A005, July 16–18, 2013
Paper No: IPACK2013-73137
DOI: https://doi.org/10.1115/IPACK2013-73137
View Paper
PDF
Topics: Creep, Lead-free solders, Tin, Alloys, Particulate matter, Solders, Temperature, Melting, Melting point, Particle size
Proceedings Papers

High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates

Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 763-771, July 6–8, 2011
Paper No: IPACK2011-52220
DOI: https://doi.org/10.1115/IPACK2011-52220
View Paper
PDF
Topics: Fracture (Materials), Fracture (Process), Solder joints, Tin, Fracture toughness, Solders, Yield strength, Failure, Intermetallic compounds, Microcracks
Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011
Paper No: IPACK2011-52221
DOI: https://doi.org/10.1115/IPACK2011-52221
View Paper
PDF
Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)
Proceedings Papers

Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering

J. Liu, P. Kumar, I. Dutta, R. Raj, M. Renavikar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 385-387, July 19–23, 2009
Paper No: InterPACK2009-89194
DOI: https://doi.org/10.1115/InterPACK2009-89194
View Paper
PDF
Topics: Sintering, Solders, Grain boundaries, Melting point, Thermal conductivity, Deformation, Design, Tin
Proceedings Papers

Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions

P. Kumar, Z. Huang, I. Dutta, R. Mahajan, M. Renavikar, R. Sidhu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 389-396, July 19–23, 2009
Paper No: InterPACK2009-89205
DOI: https://doi.org/10.1115/InterPACK2009-89205
View Paper
PDF
Topics: Dynamic testing (Materials), Fracture (Materials), Solder joints, Solders, Tin
Proceedings Papers

Mechanistic Model for Aging Influenced Steady State Flow Behavior of Sn3.8Ag0.7Cu Solder Alloys

K. Mysore, S. Chavali, D. Chan, G. Subbarayan, I. Dutta, V. Gupta, D. Edwards
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 443-450, July 19–23, 2009
Paper No: InterPACK2009-89401
DOI: https://doi.org/10.1115/InterPACK2009-89401
View Paper
PDF
Topics: Alloys, Flow (Dynamics), Solders, Steady state, Creep, Temperature, Plasticity, Stress, Geometry, Shear (Mechanics)
Proceedings Papers

Effect of Ag and Cu Concentrations on Creep of Sn-Based Solders

T. Chen, I. Dutta, S. Jadhav
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 399-405, July 8–12, 2007
Paper No: IPACK2007-33420
DOI: https://doi.org/10.1115/IPACK2007-33420
View Paper
PDF
Topics: Creep, Solders, Tin, Alloys, Ball-Grid-Array packaging, Steady state, Diffusion (Physics), Dislocations, Particulate matter, Solid solutions
Proceedings Papers

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

X. Long, I. Dutta, R. Guduru, R. Prasanna, M. Pacheco
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 539-546, July 8–12, 2007
Paper No: IPACK2007-33271
DOI: https://doi.org/10.1115/IPACK2007-33271
View Paper
PDF
Topics: Ball-Grid-Array packages, Reliability, Solders, Solder joints, Ball-Grid-Array packaging, Temperature, Tension, Damage, Design, Engineering simulation
Proceedings Papers

Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling

I. Dutta, D. Pan, S. Jadhav, R. Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1299-1306, July 17–22, 2005
Paper No: IPACK2005-73408
DOI: https://doi.org/10.1115/IPACK2005-73408
View Paper
PDF
Topics: Creep, Lead-free solders, Modeling, Testing, Solder joints, Ball-Grid-Array packaging, Tin, Stress, Intermetallic compounds, Particulate matter
Proceedings Papers

Creep and Microstructural Evolution in Lead-Free Microelectronic Solder Joints

I. Dutta, C. Park, S. Choi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 417-422, July 6–11, 2003
Paper No: IPACK2003-35209
DOI: https://doi.org/10.1115/IPACK2003-35209
View Paper
PDF
Topics: Creep, Solder joints, Testing, Alloys, Lead-free solders, Solders, Tin, Ball-Grid-Array packaging, Flip-chip, Flip-chip devices