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I. M. Cohen
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Proceedings Papers

Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 121-127, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1037
https://doi.org/10.1115/IMECE1996-1037
View Paper titled, Microelectronic Chip Attach With Silver Filled Epoxies: An Analytical and Experimental Study
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Topics: Epoxy adhesives, Epoxy resins, Silver, Bonding, Flow (Dynamics)
Proceedings Papers

A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 129-136, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1038
https://doi.org/10.1115/IMECE1996-1038
View Paper titled, A Study of the Electronic Flame off Discharge Process Used for Ball Bonding in Microelectronic Packaging
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Topics: Bonding, Flames, Microelectronic packaging, Wire, Heat transfer, Temperature, Transients (Dynamics), Copper, Electric discharge, Grain boundaries
Proceedings Papers

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Srinivas S. Sripada, P. S. Ayyaswamy, I. M. Cohen
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 55-61, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0831
https://doi.org/10.1115/IMECE1997-0831
View Paper titled, Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process
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Topics: Anodes, Computation, Flames, Heat transfer, Wire, Melting, Bonding, Computer simulation, Electric arcs, Heat
Proceedings Papers

A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball

Srinivas S. Sripada, I. M. Cohen, P. S. Ayyaswamy
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 281-286, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0715
https://doi.org/10.1115/IMECE1998-0715
View Paper titled, A Multigrid Simulation of the Rapid Solidification of a Pendent Molten Ball
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Topics: Simulation, Solidification, Plasmas (Ionized gases), Wire, Microelectronic packaging, Collisions (Physics), Electric discharge, Energy budget (Physics), Finite volume methods, Flames
Journal Articles

TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes

S. S. Sripada, P. S. Ayyaswamy, I. M. Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1998, 120(4): 939–942.
https://doi.org/10.1115/1.2825913
Published Online: November 1, 1998
View Article titled, TECHNICAL NOTE: Weakly Ionized Plasma Arc Heat Transfer Between Geometrically Dissimilar Electrodes
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Topics: Electric arcs, Electrodes, Heat transfer, Plasmas (Ionized gases)
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 34–38.
https://doi.org/10.1115/1.2909299
Published Online: March 1, 1993
View Article titled, Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging
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Topics: Packaging, Simulation, Stress, Transients (Dynamics), Temperature, Thermal stresses, Composite materials, Delamination, Electronic equipment, Elongation
Journal Articles

Effect of Polarity on Heat Transfer in the Ball Formation Process

L. J. Huang, M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 33–39.
https://doi.org/10.1115/1.2905364
Published Online: March 1, 1991
View Article titled, Effect of Polarity on Heat Transfer in the Ball Formation Process
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Topics: Heat transfer, Wire, Anodes, Aluminum, Copper, Bonding, Electric discharge, Heat, Pressure, Semiconductors (Materials)
Journal Articles

A Note on the Interface Condition in Phase Change Problems

L. J. Huang, P. S. Ayyaswamy, I. M. Cohen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. February 1991, 113(1): 244–247.
https://doi.org/10.1115/1.2910534
Published Online: February 1, 1991
View Article titled, A Note on the Interface Condition in Phase Change Problems
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Topics: Heat conduction
Journal Articles

An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process

L. J. Huang, K. Ramakrishna, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 199–206.
https://doi.org/10.1115/1.3226534
Published Online: September 1, 1989
View Article titled, An Analysis of Shrinkage Porosity in Aluminum Ball Bonding Process
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Topics: Aluminum, Bonding, Porosity, Shrinkage (Materials), Alloys, Metals, Density, Solidification, Accounting, Geometry
Journal Articles

Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions

K. Ramakrishna, I. M. Cohen, P. S. Ayyaswamy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1989, 111(3): 592–597.
https://doi.org/10.1115/1.3250723
Published Online: August 1, 1989
View Article titled, Temperature Response of a Heated Cylinder Subject to Side Cooling: Asymptotic and Numerical Solutions
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Topics: Cooling, Cylinders, Temperature, Heat flux, Bonding, Heat, Heat conduction, Heat losses, Heat transfer, Manufacturing