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J. H. Lau
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Proceedings Papers

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, C. L. Jiaa, S. J. Erasmus
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 169-176, November 11–16, 2001
Paper No: IMECE2001/EPP-24721
DOI: https://doi.org/10.1115/IMECE2001/EPP-24721
View Paper titled, Corrosion Analysis of a Fiber-Optic Transceiver Housing
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Topics: Corrosion, Fibers, Cross section (Physics), Die casting (Process), Die castings (Product), Metallography, Temperature, Weight (Mass), Zinc alloys
Journal Articles

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus
Journal: Journal of Electronic Packaging
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 379–384.
DOI: https://doi.org/10.1115/1.1510862
Published Online: December 12, 2002
View Article titled, Corrosion Analysis of a Fiber-Optic Transceiver Housing
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Topics: Corrosion, Fibers, Weight (Mass)
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
DOI: https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

J. H. Lau, K.-L. Chen
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 208–212.
DOI: https://doi.org/10.1115/1.2792236
Published Online: September 1, 1997
View Article titled, Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Copper, Deflection, Epoxy adhesives, Epoxy resins, Flat heat pipes, Glass, Printed circuit boards, Temperature distribution
Journal Articles

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

J. H. Lau
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 1993, 115(3): 337–339.
DOI: https://doi.org/10.1115/1.2909337
Published Online: September 1, 1993
View Article titled, Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads
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Topics: Deflection, Fibers, Optical glass, Stress
Journal Articles

Structural Analysis of Printed Circuit Board Systems

Peter A. Engel, Author, J. H. Lau, Reviewer
Journal: Journal of Electronic Packaging
Article Type: Book Reviews
J. Electron. Packag. September 1993, 115(3): 343–344.
DOI: https://doi.org/10.1115/1.2909340
Published Online: September 1, 1993
View Article titled, Structural Analysis of Printed Circuit Board Systems
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Topics: Printed circuit boards, Structural analysis
Journal Articles

Elasto-Plastic Large Deflection Analysis of a Copper Film

J. H. Lau
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 221–225.
DOI: https://doi.org/10.1115/1.2906421
Published Online: June 1, 1992
View Article titled, Elasto-Plastic Large Deflection Analysis of a Copper Film
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Topics: Copper, Deflection, Ductility, Pressure, Stress, Finite element methods, Mechanical behavior
Journal Articles

The Finite Element in Thermomechanics

Tai-Ran Hsu, Author, J. H. Lau, Reviewer
Journal: Journal of Electronic Packaging
Article Type: Book Reviews
J. Electron. Packag. September 1991, 113(3): 329.
DOI: https://doi.org/10.1115/1.2905415
Published Online: September 1, 1991
View Article titled, The Finite Element in Thermomechanics
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Topics: Finite element analysis, Thermomechanics
Journal Articles

Thermoelastic Solutions for a Finite Substrate With an Electronic Device

J. H. Lau
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 1991, 113(1): 84–88.
DOI: https://doi.org/10.1115/1.2905372
Published Online: March 1, 1991
View Article titled, Thermoelastic Solutions for a Finite Substrate With an Electronic Device
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Topics: Thermoelasticity, Design, Displacement, Finite element analysis, Steady state, Stress, Symmetry (Physics), Temperature, Temperature distribution
Journal Articles

A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods

J. H. Lau
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 1989, 111(4): 313–320.
DOI: https://doi.org/10.1115/1.3226554
Published Online: December 1, 1989
View Article titled, A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods
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Topics: Electronic packaging, Finite element methods, Thermal stresses, Composite materials, Errors
Journal Articles

Finite Element Modeling for Optimizing Hermetic Package Reliability

J. H. Lau, L. B. Lian-Mueller
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 255–260.
DOI: https://doi.org/10.1115/1.3226544
Published Online: December 1, 1989
View Article titled, Finite Element Modeling for Optimizing Hermetic Package Reliability
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Topics: Finite element analysis, Modeling, Reliability, Design, Microwaves, Construction, Finite element methods, Finite element model, Leakage, Thermal stresses
Journal Articles

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

J. H. Lau
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 2–8.
DOI: https://doi.org/10.1115/1.3226505
Published Online: March 1, 1989
View Article titled, Thermal Stress Analysis of SMT PQFP Packages and Interconnections
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Topics: Thermal stresses, Manufacturing, Solder joints, Stress, Design, Finite element methods, Mechanical behavior, Reliability, Surface mount assemblies
Journal Articles

Deformation of Curved Bars With Creep

J. H. Lau, C. K. Hu
Journal: Journal of Engineering for Gas Turbines and Power
Article Type: Research Papers
J. Eng. Gas Turbines Power. January 1985, 107(1): 225–230.
DOI: https://doi.org/10.1115/1.3239687
Published Online: January 1, 1985
View Article titled, Deformation of Curved Bars With Creep
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Topics: Creep, Deformation, Stress
Journal Articles

Bending and Twisting of Pipes With Strain Hardening

J. H. Lau, T. T. Lau
Journal: Journal of Pressure Vessel Technology
Article Type: Research Papers
J. Pressure Vessel Technol. May 1984, 106(2): 188–195.
DOI: https://doi.org/10.1115/1.3264327
Published Online: May 1, 1984
View Article titled, Bending and Twisting of Pipes With Strain Hardening
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Topics: Pipes, Work hardening, Approximation, Circular cylinders, Cylinders, Deformation, Finite element methods, Shear (Mechanics), Stress-strain curves
Journal Articles

Vibration Frequencies and Mode Shapes for a Constrained Cantilever

J. H. Lau
Journal: Journal of Applied Mechanics
Article Type: Design Data And Methods
J. Appl. Mech. March 1984, 51(1): 182–187.
DOI: https://doi.org/10.1115/1.3167565
Published Online: March 1, 1984
View Article titled, Vibration Frequencies and Mode Shapes for a Constrained Cantilever
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Topics: Cantilevers, Mode shapes, Oscillating frequencies
Journal Articles

Vibration Frequencies of Tapered Bars With End Mass

J. H. Lau
Journal: Journal of Applied Mechanics
Article Type: Design Data And Methods
J. Appl. Mech. March 1984, 51(1): 179–181.
DOI: https://doi.org/10.1115/1.3167564
Published Online: March 1, 1984
View Article titled, Vibration Frequencies of Tapered Bars With End Mass
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Topics: Oscillating frequencies
Journal Articles

Creep of Thin-Walled Circular Cylinder Under Axial Force, Bending, and Twisting Moments

J. H. Lau, S. S. Jung, T. T. Lau
Journal: Journal of Engineering for Gas Turbines and Power
Article Type: Research Papers
J. Eng. Gas Turbines Power. January 1984, 106(1): 79–83.
DOI: https://doi.org/10.1115/1.3239554
Published Online: January 1, 1984
View Article titled, Creep of Thin-Walled Circular Cylinder Under Axial Force, Bending, and Twisting Moments
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Topics: Circular cylinders, Creep, Cylinders, Shear (Mechanics)
Journal Articles

Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep

J. H. Lau, G. K. Listvinsky
Journal: Journal of Applied Mechanics
Article Type: Technical Briefs
J. Appl. Mech. June 1981, 48(2): 439–441.
DOI: https://doi.org/10.1115/1.3157640
Published Online: June 1, 1981
View Article titled, Bending and Twisting of Internally Pressurized Thin-Walled Cylinder With Creep
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Topics: Creep, Cylinders