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Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Article titled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article titled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Proceedings Papers

Numerical and Experimental Investigation on Thermal Characteristics of Deformable Thin Film Mirrors Package and Its Performance Optimization

Jae Choon Kim, Jin Taek Chung, Jae Hong Min, Dong Jin Lee, Ji-Hyuk Yu, JuHwan Lim, Byeong-Kwon Ju, SungWoo Hwang
Proc. ASME. HT2008, Heat Transfer: Volume 2, 663-669, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56292
https://doi.org/10.1115/HT2008-56292
View Paper titled, Numerical and Experimental Investigation on Thermal Characteristics of Deformable Thin Film Mirrors Package and Its Performance Optimization
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Topics: Mirrors, Optimization, Thin films, Temperature, Circuits, Control systems, Feedback, Steady state, Temperature control