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James Geer
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Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041008.
Paper No: EP-16-1053
https://doi.org/10.1115/1.4034856
Published Online: October 20, 2016
View Article titled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
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Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)
Proceedings Papers

Perimeter Cooling Unit and Localized Row-Based Cooling Unit Transient Air Flow Effects Modeling and Characterization in Data Centers

Tianyi Gao, James Geer, Bahgat G. Sammakia, Russell Tipton, Mark Seymour
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51012
https://doi.org/10.1115/IMECE2015-51012
View Paper titled, Perimeter Cooling Unit and Localized Row-Based Cooling Unit Transient Air Flow Effects Modeling and Characterization in Data Centers
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Topics: Air flow, Cooling, Data centers, Modeling, Transients (Dynamics), Cooling systems, Computational fluid dynamics, Thermal management, Coolers, Cutting
Proceedings Papers

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Tianyi Gao, Bahgat G. Sammakia, James Geer, Bruce Murray, Russell Tipton, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48069
https://doi.org/10.1115/IPACK2015-48069
View Paper titled, Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center
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Topics: Cooling, Data centers, Coolers, Energy consumption, Cooling systems, Density, Heat, Temperature, Coal, Computational fluid dynamics
Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
https://doi.org/10.1115/IPACK2015-48071
View Paper titled, Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density
Journal Articles

Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations

Tianyi Gao, James Geer, Bahgat Sammakia
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2015, 7(4): 041017.
Paper No: TSEA-15-1057
https://doi.org/10.1115/1.4031222
Published Online: September 10, 2015
View Article titled, Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations
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Topics: Flow (Dynamics), Fluids, Heat exchangers, Temperature, Transients (Dynamics), Cross-flow, Modeling
Proceedings Papers

Experimentally Verified Transient Models of Data Center Crossflow Heat Exchangers

Tianyi Gao, Bahgat Sammakia, James Geer, Milnes David, Roger Schmidt
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A081, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-36022
https://doi.org/10.1115/IMECE2014-36022
View Paper titled, Experimentally Verified Transient Models of Data Center Crossflow Heat Exchangers
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Topics: Data centers, Heat exchangers, Transients (Dynamics), Computational fluid dynamics, Coolers, Cooling systems, Doors, Simulation, Air conditioners, Computers
Proceedings Papers

Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package

Anand Desai, James Geer, Bahgat Sammakia
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 617-623, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33045
https://doi.org/10.1115/IPACK2007-33045
View Paper titled, Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package
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Topics: Boundary-value problems, Computer simulation, Heat conduction, Steady state, Temperature, Temperature distribution
Journal Articles

Finite Difference Schemes for Diffusion Problems Based on a Hybrid Perturbation–Galerkin Method

James Geer, John Fillo
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. June 2008, 130(6): 061701.
https://doi.org/10.1115/1.2891135
Published Online: April 21, 2008
View Article titled, Finite Difference Schemes for Diffusion Problems Based on a Hybrid Perturbation–Galerkin Method
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Topics: Diffusion (Physics), Errors, Galerkin method, Stability, Boundary-value problems, Composite materials
Proceedings Papers

Heat Conduction in Three Dimensional Stacked Packages

Anand Desai, James Geer, Bahgat Sammakia
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 467-472, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79771
https://doi.org/10.1115/IMECE2005-79771
View Paper titled, Heat Conduction in Three Dimensional Stacked Packages
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Topics: Heat conduction, Thermal management, Geometry, Heat, Carbon nanotubes, Cooling, Modeling, Steady state, Thermal conductivity
Proceedings Papers

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Anand Desai, James Geer, Bahgat Sammakia
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-431, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79732
https://doi.org/10.1115/IMECE2005-79732
View Paper titled, Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface
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Topics: Carbon, Carbon nanotubes, Cylinders, Electrical measurement, Energy dissipation, Flat heat pipes, Geometry, Heat conduction, Heat sinks, Modeling
Proceedings Papers

Finite Difference Schemes for Diffusion Problems Based on a Hybrid Perturbation Galerkin Method

James Geer, John Fillo
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 593-602, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16162
https://doi.org/10.1115/IMECE2006-16162
View Paper titled, Finite Difference Schemes for Diffusion Problems Based on a Hybrid Perturbation Galerkin Method
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Topics: Diffusion (Physics), Galerkin method, Boundary-value problems, Errors, Finite difference methods, Stability
Journal Articles

Heat Conduction in Multilayered Rectangular Domains

James Geer, Anand Desai, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 440–451.
https://doi.org/10.1115/1.2804094
Published Online: April 7, 2007
View Article titled, Heat Conduction in Multilayered Rectangular Domains
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Topics: Boundary-value problems, Heat, Heat conduction, Temperature, Thermal management
Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
https://doi.org/10.1115/1.2159003
Published Online: May 18, 2005
View Article titled, Models of Steady Heat Conduction in Multiple Cylindrical Domains
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Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management
Journal Articles

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
https://doi.org/10.1115/1.2161231
Published Online: May 10, 2005
View Article titled, A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
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Topics: Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Thermal management