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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
DOI: https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
DOI: https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
DOI: https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Proceedings Papers

Design and Research of Offshore Oil Spill Removal Ship With Variable Angle of Attack

Qibin Ou, Jin Yang, Zhenxiang Zhang, Luo Liu, Yichi Zhang, Ximo Qu
Proc. ASME. OMAE2021, Volume 6: Ocean Engineering, V006T06A039, June 21–30, 2021
Paper No: OMAE2021-63546
DOI: https://doi.org/10.1115/OMAE2021-63546
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Topics: Design, Ocean engineering, Ships
Proceedings Papers

Research on Calculation Method of Density and Rheology of High-Temperature High-Pressure Drilling Fluid

Lei Wang, Jin Yang, Zhengkang Li, Xinyue He, Lei Li, Xu Zhou
Proc. ASME. OMAE2021, Volume 10: Petroleum Technology, V010T11A062, June 21–30, 2021
Paper No: OMAE2021-63622
DOI: https://doi.org/10.1115/OMAE2021-63622
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Topics: Computational methods, Density, Drilling, Fluid density, Fluids, High pressure (Physics), High temperature, Rheology, Shear stress
Journal Articles

A Novel Method for Fracture Pressure Prediction in Shallow Formation During Deep-Water Drilling

Jin Yang, Shujie Liu, Huanhuan Wang, Xu Zhou, Yu Song, Renjun Xie, Zhenxiang Zhang, Qishuai Yin, Fei Xu
Journal: Journal of Energy Resources Technology
Article Type: Research Papers
J. Energy Resour. Technol. March 2022, 144(3): 033005.
Paper No: JERT-21-1223
DOI: https://doi.org/10.1115/1.4051394
Published Online: June 29, 2021
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Topics: Density, Drilling, Fracture (Materials), Fracture (Process), Pressure, Rocks, Sediments, Soil, Water, Failure
Journal Articles

Corrosion Study on Single-Phase Liquid Cooling Cold Plates With Inhibited Propylene Glycol/Water Coolant for Data Centers

David Shia, Jin Yang, Sean Sivapalan, Rithi Soeung, Christian Amoah-Kusi
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111012.
Paper No: MANU-21-1056
DOI: https://doi.org/10.1115/1.4051059
Published Online: June 14, 2021
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Topics: Coolants, Cooling, Copper, Corrosion, Plates (structures), Water, Data centers, Fluids, Brazing, Risk
Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2019, 141(1): 010301.
Paper No: EP-18-1120
DOI: https://doi.org/10.1115/1.4042803
Published Online: March 6, 2019
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Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry
Journal Articles

A Comprehensive Wellbore Stability Model Considering Poroelastic and Thermal Effects for Inclined Wellbores in Deepwater Drilling

Xuyue Chen, Deli Gao, Jin Yang, Ming Luo, Yongcun Feng, Xin Li
Journal: Journal of Energy Resources Technology
Article Type: Research-Article
J. Energy Resour. Technol. September 2018, 140(9): 092903.
Paper No: JERT-18-1029
DOI: https://doi.org/10.1115/1.4039983
Published Online: April 26, 2018
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Topics: Collapse, Drilling, Fracture (Process), Pressure, Stability, Stress, Temperature effects, Underwater drilling, Pressure gradient, Fracture (Materials)
Proceedings Papers

Environmental Fatigue Evaluation for Interface of Dissimilar Metal Welded Piping

Dae Geon Lee, Dae Soo Kim, Kyeong Jin Yang, Joon Ho Lee, Seong Cheol Jang
Proc. ASME. PVP2017, Volume 3A: Design and Analysis, V03AT03A047, July 16–20, 2017
Paper No: PVP2017-65481
DOI: https://doi.org/10.1115/PVP2017-65481
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Topics: Fatigue, Metals, Pipes, Welding, Alloys, Evaluation methods, ASME Boiler and Pressure Vessel Code, ASME Standards, Carbon steel, Coolants
Proceedings Papers

Numerical Simulation on Hydrogen Dispersion in Automobiles due to Storage Cylinder Failure

Yan-Lei Liu, Jin-Yang Zheng, Shu-Xin Han, Yong-Zhi Zhao
Proc. ASME. PVP2011, Volume 1: Codes and Standards, 681-686, July 17–21, 2011
Paper No: PVP2011-57226
DOI: https://doi.org/10.1115/PVP2011-57226
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Topics: Automobiles, Computer simulation, Cylinders, Failure, Hydrogen, Leakage, Storage
Proceedings Papers

Non-Linear Numerical Analysis of Large-Sized Double-Cone Sealing Process

Shui-ping Sheng, Shu-xin Han, Jin-yang Zheng, Yong-jian Gao, Ning Zhou
Proc. ASME. PVP2009, Volume 1: Codes and Standards, 473-478, July 26–30, 2009
Paper No: PVP2009-77843
DOI: https://doi.org/10.1115/PVP2009-77843
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Topics: Clearances (Engineering), Finite element analysis, Numerical analysis, Sealing (Process)
Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021006.
DOI: https://doi.org/10.1115/1.4001832
Published Online: June 23, 2010
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Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)
Proceedings Papers

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 365-374, July 8–12, 2007
Paper No: IPACK2007-33542
DOI: https://doi.org/10.1115/IPACK2007-33542
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Topics: Flip-chip, Flip-chip devices, Inspection, Modal analysis, Solders, Computer simulation, Dynamic response, Electronics, Experimental methods, Interferometry
Proceedings Papers

Defect Detection of Flip Chip Solder Bumps Through Local Temporal Coherence Analysis of Laser Ultrasound Signals

Jin Yang, Charles Ume
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 375-384, November 11–15, 2007
Paper No: IMECE2007-42571
DOI: https://doi.org/10.1115/IMECE2007-42571
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Topics: Flaw detection, Flip-chip devices, Lasers, Signals, Solders, Ultrasound, Inspection, Ball-Grid-Array packaging, Interferometry, Printed circuit boards
Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
DOI: https://doi.org/10.1115/1.3068301
Published Online: February 18, 2009
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Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection
Journal Articles

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031009.
DOI: https://doi.org/10.1115/1.2957328
Published Online: August 1, 2008
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Topics: Flip-chip, Flip-chip devices, Inspection, Lasers, Modal analysis, Solders, Ultrasound, Mode shapes
Journal Articles

Elastic Analysis for Defects in an Orthotropic Kirchhoff Plate

Kyeong-Jin Yang, Ki-Young Lee, Jong-Hwa Chang
Journal: Journal of Applied Mechanics
Article Type: Technical Papers
J. Appl. Mech. May 2007, 74(3): 438–446.
DOI: https://doi.org/10.1115/1.2338051
Published Online: April 17, 2006
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Topics: Deformation, Dislocations, Elastic analysis, Polynomials, Stress, Tensors, Elasticity, Plates (structures), Green's function methods