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K. N. Seetharamu
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Journal Articles

Effect of Ultralow Concentrated Reduced Graphene Oxide Nanofluid on Radiator Performance

Babu Rao Ponangi, V. Krishna, K. N. Seetharamu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2021, 143(8): 082501.
Paper No: HT-21-1132
https://doi.org/10.1115/1.4051233
Published Online: June 28, 2021
View Article titled, Effect of Ultralow Concentrated Reduced Graphene Oxide Nanofluid on Radiator Performance
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Topics: Fluids, Graphene, Nanofluids, Nanoparticles, Temperature, Convection, Friction
Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
https://doi.org/10.1115/1.4005294
Published Online: December 21, 2011
View Article titled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
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Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper
Proceedings Papers

Numerical Model to Analyse IC Chip Encapsulation Process

Venkatesh M. Kulkarni, Ishak Abdul Azid, K. N. Seetharamu, P. A. Aswatha Narayana
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1841-1848, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73197
https://doi.org/10.1115/IPACK2005-73197
View Paper titled, Numerical Model to Analyse IC Chip Encapsulation Process
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Topics: Computer simulation, Flip-chip packages, Flow (Dynamics), Fluids, Simulation, Cavities, Epoxy adhesives, Epoxy resins, Geometry, Pressure
Proceedings Papers

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

Teck Joo Goh, Chia-Pin Chiu, K. N. Seetharamu, G. A. Quadir, Z. A. Zainal
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 323-330, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35142
https://doi.org/10.1115/IPACK2003-35142
View Paper titled, Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations
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Topics: Automotive design, Finite element analysis, Flip-chip, Flip-chip devices, Thermal characterization, Vehicles
Journal Articles

Interaction Effects Between Surface Radiation and Turbulent Natural Convection in Square and Rectangular Enclosures

K. Velusamy, Scientific Officer,, T. Sundararajan, Professor,, K. N. Seetharamu, Professor,
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. December 2001, 123(6): 1062–1070.
https://doi.org/10.1115/1.1409259
Published Online: April 10, 2001
View Article titled, Interaction Effects Between Surface Radiation and Turbulent Natural Convection in Square and Rectangular Enclosures
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Topics: Flow (Dynamics), Heat transfer, Natural convection, Radiation (Physics), Temperature, Turbulence, Convection, Rayleigh number, Heat conduction, Fluids
Journal Articles

Direct Contact Evaporation Between Two Immiscible Liquids in a Spray Column

K. N. Seetharamu, P. Battya
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1989, 111(3): 780–785.
https://doi.org/10.1115/1.3250751
Published Online: August 1, 1989
View Article titled, Direct Contact Evaporation Between Two Immiscible Liquids in a Spray Column
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Topics: Evaporation, Sprays
Journal Articles

Turbulent Heat Transfer by Free Convection from a Rough Surface

K. Ramakrishna, K. N. Seetharamu, P. K. Sarma
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 1978, 100(4): 727–729.
https://doi.org/10.1115/1.3450886
Published Online: November 1, 1978
View Article titled, Turbulent Heat Transfer by Free Convection from a Rough Surface
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Topics: Natural convection, Surface roughness, Turbulent heat transfer