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Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104.

Paper No: EP-20-1142

DOI: https://doi.org/10.1115/1.4052074

Published Online: September 24, 2021

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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials

Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020

Paper No: IPACK2020-2562

DOI: https://doi.org/10.1115/IPACK2020-2562

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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity

Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109.

Paper No: EP-19-1123

DOI: https://doi.org/10.1115/1.4047471

Published Online: June 29, 2020

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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems

Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer

J. Electron. Packag. September 2020, 142(3): 031106.

Paper No: EP-19-1098

DOI: https://doi.org/10.1115/1.4046848

Published Online: April 24, 2020

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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles

Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019

Paper No: IPACK2019-6334

DOI: https://doi.org/10.1115/IPACK2019-6334

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Topics: Artificial neural networks, Genetic algorithms, Heat

Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019

Paper No: IPACK2019-6514

DOI: https://doi.org/10.1115/IPACK2019-6514

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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption

Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017

Paper No: IPACK2017-74222

DOI: https://doi.org/10.1115/IPACK2017-74222

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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

DOI: https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Proceedings Papers

Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC

Leila Choobineh, Ankur Jain, Jared Jones

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 11–17, 2016

Paper No: IMECE2016-65543

DOI: https://doi.org/10.1115/IMECE2016-65543

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Topics: Thermal resistance, Computer simulation, Design, Temperature, Boundary-value problems, Data acquisition, Heating, Modeling, Reliability, Thermal analysis

Proceedings Papers

Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect

Arya Banait, Vivek Vishwakarma, Leila Choobineh, Ankur Jain

Proc. ASME. IMECE2013, Volume 7A: Fluids Engineering Systems and Technologies, V07AT08A006, November 15–21, 2013

Paper No: IMECE2013-65865

DOI: https://doi.org/10.1115/IMECE2013-65865

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Topics: Plasma desorption mass spectrometry, Bubbles, Membranes, Biocompatibility, Design, Filtration, Glass, Hardening (Curing), Heating, Microchannels

Proceedings Papers

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Leila Choobineh, Dereje Agonafer, Ankur Jain

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013

Paper No: IPACK2013-73166

DOI: https://doi.org/10.1115/IPACK2013-73166

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Topics: Modeling, Temperature distribution, Thermal management, Temperature, Finite element analysis, Heat transfer, Design, Energy conservation, Fourier series, Heat

Proceedings Papers

Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)

Leila Choobineh, Nick Vo, Trent Uehling, Ankur Jain

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A034, July 16–18, 2013

Paper No: IPACK2013-73167

DOI: https://doi.org/10.1115/IPACK2013-73167

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Topics: Integrated circuits

Journal citation

NARROW

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC

Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)

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