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Proceedings Papers

Wafer Level Underfill Processing

Luu Nguyen, Christopher Quentin, Phuong Nguyen
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 63-68, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2247
https://doi.org/10.1115/IMECE2000-2247
View Paper titled, Wafer Level Underfill Processing
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Topics: Semiconductor wafers, Flip-chip, Flip-chip devices, Manufacturing, Adhesives, Cycles, Film thickness, Flip-chip packages, Flow (Dynamics), Industrial research
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8358
https://doi.org/10.1115/IPACK2018-8358
View Paper titled, Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
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Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74325
https://doi.org/10.1115/IPACK2017-74325
View Paper titled, Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
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Topics: Aluminum, Copper, Electronics, High temperature, Ionic mobility, Wire, Corrosion, Diffusion (Physics), Gates (Closures), Bonding
Proceedings Papers

Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. IMECE2015, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A022, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-53742
https://doi.org/10.1115/IMECE2015-53742
View Paper titled, Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Copper, Diffusion (Physics), Electrolytic corrosion, Ions, Electrical resistivity, Molding, Temperature, Aluminum
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48638
https://doi.org/10.1115/IPACK2015-48638
View Paper titled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48639
https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A073, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39524
https://doi.org/10.1115/IMECE2014-39524
View Paper titled, High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects
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Topics: Aluminum, Copper, High temperature, Reliability, Storage, Wire, Failure, Temperature, Damage, Intermetallic compounds
Proceedings Papers

Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory

Dennis Chan, Dhruv Bhate, Ganesh Subbarayan, Luu Nguyen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 199-205, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89402
https://doi.org/10.1115/InterPACK2009-89402
View Paper titled, Characterization of Crack Fronts in a WLCSP Package: Experiments and Models for Application of a Multiscale Fracture Theory
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Topics: Fracture (Materials), Cycles, Failure analysis, Finite element model, Geometry, Solder joints, Solders, Computer software, Corners (Structural elements), Creep
Proceedings Papers

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 983-991, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73328
https://doi.org/10.1115/IPACK2005-73328
View Paper titled, Analytical and Experimental Characterization of Bonding Over Active Circuitry
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Topics: Bonding, Experimental characterization, Stress, Fracture (Materials), Wire bonding, Aluminum, Computer simulation, Cracking (Materials), Damage, Design
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Proceedings Papers

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiber-Optic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 487-493, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42667
https://doi.org/10.1115/IMECE2003-42667
View Paper titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiber-Optic System
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Topics: Fibers, Uncertainty, Complex systems, Simulated annealing, Algorithms, Flux (Metallurgy), Heat, Laser beams, Lasers, Optical fiber
Journal Articles

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
https://doi.org/10.1115/1.2753886
Published Online: November 28, 2006
View Article titled, Analytical and Experimental Characterization of Bonding Over Active Circuitry
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Topics: Bonding, Fracture (Materials), Friction, Stress, Ultrasound, Wire, Finite element analysis, Finite element model
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Article titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
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Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers