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Nicholas Niedbalski
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Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041111.
Paper No: EP-20-1028
https://doi.org/10.1115/1.4047474
Published Online: June 29, 2020
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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat