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Raffaele Luca Amalfi
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Proceedings Papers

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Paper No: IPACK2022-97729
DOI: https://doi.org/10.1115/IPACK2022-97729
View Paper titled, Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling
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Topics: Computer cooling, Cooling, Cooling systems
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Paper No: IPACK2021-73269
DOI: https://doi.org/10.1115/IPACK2021-73269
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model
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Topics: Compression, Cooling, Data centers, Heat recovery, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Paper No: IPACK2021-73270
DOI: https://doi.org/10.1115/IPACK2021-73270
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model
Click here to open pdf in another window PDF for Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model
Topics: Compression, Condensers (steam plant), Cooling, Heat recovery, Modeling, Thermal management, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Paper No: IPACK2021-73271
DOI: https://doi.org/10.1115/IPACK2021-73271
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model
Click here to open pdf in another window PDF for Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model
Topics: Compression, Compressors, Cooling, Heat recovery, Modeling, Thermal management, Vapors
Journal Articles

Special Issue Dedicated to Professor Avram Bar-Cohen

Ronald J. Warzoha, Darin J. Sharar, Raffaele Luca Amalfi, Andrew Tay
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. December 2021, 143(4): 040301.
Paper No: EP-21-1127
DOI: https://doi.org/10.1115/1.4052174
Published Online: September 13, 2021
View Article titled, Special Issue Dedicated to Professor Avram Bar-Cohen
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Topics: Engineering teachers