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Journal Articles

Effect of Material Distribution in the Unit Cell on Effective Thermal Conductivity and Young's Modulus of Cellular Structure

Akshay Wagh, Sagar Deshmukh, Sripriya Ramamoorthy, Shankar Krishnan
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. January 2023, 90(1): 011008.
Paper No: JAM-22-1228
DOI: https://doi.org/10.1115/1.4056000
Published Online: November 7, 2022
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Topics: Geometry, Porosity, Struts (Engineering), Thermal conductivity, Young's modulus
Journal Articles

A Model for Sound Propagation Through Corrugated Porous Structures With Mean Flow

Harshavardhan Ronge, Shripad Upalkar, Akshay Wagh, Radhika Choudhary, Shankar Krishnan, Sripriya Ramamoorthy
Journal: Journal of Vibration and Acoustics
Article Type: Research Papers
J. Vib. Acoust. April 2023, 145(2): 021007.
Paper No: VIB-22-1171
DOI: https://doi.org/10.1115/1.4055847
Published Online: October 28, 2022
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Topics: Acoustics, Flow (Dynamics), Geometry, Porous materials, Ducts, Porosity
Includes: Supplementary data
Journal Articles

Analysis of Fluid Flow and Heat Transfer in Corrugated Perforated Plate Fin Heat Sinks

Shripad A. Upalkar, Saksham Gakhar, Shankar Krishnan
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061013.
Paper No: TSEA-21-1350
DOI: https://doi.org/10.1115/1.4052598
Published Online: November 18, 2021
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Pressure drop, Fluid dynamics, Geometry
Journal Articles

Mineral Oil Immersion Cooling of Lithium-Ion Batteries: An Experimental Investigation

Amol Trimbake, Chandra Pratap Singh, Shankar Krishnan
Journal: Journal of Electrochemical Energy Conversion and Storage
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2022, 19(2): 021007.
Paper No: JEECS-21-1107
DOI: https://doi.org/10.1115/1.4052094
Published Online: August 27, 2021
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Topics: Batteries, Cooling, Lithium-ion batteries, Mineral oil, Temperature, Skin
Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010801.
Paper No: EP-20-1113
DOI: https://doi.org/10.1115/1.4050002
Published Online: August 6, 2021
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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state
Journal Articles

Numerical Investigation of Heat Transfer Enhancement Due to Flow Agitators Between Fins

Aditya Patki, Shankar Krishnan
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2022, 14(2): 021002.
Paper No: TSEA-21-1006
DOI: https://doi.org/10.1115/1.4051135
Published Online: June 18, 2021
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Topics: Flow (Dynamics), Heat transfer, Pressure drop, Reynolds number, Fins, Flow visualization, Computer simulation, Oscillations, Temperature, Heat sinks
Journal Articles

Control of Boiling Instabilities in a Two-Phase Pumpless Loop Using Water-Alcohol Mixtures

Ankit Bhagat, Gautam Ghaisas, John Mathew, Shankar Krishnan
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2021, 13(2): 021031.
Paper No: TSEA-20-1650
DOI: https://doi.org/10.1115/1.4049755
Published Online: February 26, 2021
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Topics: Boiling, Ethanol, Water, Heat transfer, Two-phase flow, Flow (Dynamics), Stability, Bubbles, Microchannels, Coolants
Proceedings Papers

Computing Boolean Combinations of Solids Composed of Free-Form Surfaces

Shankar Krishnan, Dinesh Manocha
Proc. ASME. DETC-CIE96, Volume 1: Design for Manufacturing Conference, V001T01A035, August 18–22, 1996
Paper No: 96-DETC/DFM-1296
DOI: https://doi.org/10.1115/96-DETC/DFM-1296
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Topics: Design for Manufacturing, Solids, Algorithms, Splines, Chain
Proceedings Papers

A New Design Methodology of Thermal Barrier Coating (TBC) for Internal Combustion Engines

Chandra Pratap Singh, Arif Taibani, Shankar Krishnan
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T11A004, July 13–15, 2020
Paper No: HT2020-9070
DOI: https://doi.org/10.1115/HT2020-9070
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Topics: Coatings, Design methodology, Internal combustion engines, Temperature, Thermal barrier coatings
Journal Articles

Performance Evaluation and Characterization of a Direct Absorption Solar Humidifier for Humidification–Dehumidification Desalination

Tapan Dave, Shankar Krishnan
Journal: Journal of Solar Energy Engineering
Article Type: Research Papers
J. Sol. Energy Eng. February 2021, 143(1): 011010.
Paper No: SOL-20-1107
DOI: https://doi.org/10.1115/1.4047670
Published Online: July 28, 2020
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Topics: Humidifiers, Solar energy, Water
Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015
Paper No: IPACK2015-48640
DOI: https://doi.org/10.1115/IPACK2015-48640
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Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards
Proceedings Papers

Enhanced Gas-Side Heat Transfer in Rectangular Micro-Honeycombs

Shankar Krishnan, Steve Leith, Terry Hendricks
Proc. ASME. ES2012, ASME 2012 6th International Conference on Energy Sustainability, Parts A and B, 867-874, July 23–26, 2012
Paper No: ES2012-91223
DOI: https://doi.org/10.1115/ES2012-91223
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Topics: Heat transfer, Honeycomb structures, Cooling, Design, Heat exchangers, Shapes, Manufacturing, Air conditioning, Coolers, Cooling systems
Proceedings Papers

Capillary Rise and Evaporative Heat Transfer in Nano-Structured Multi-Mode Wicks

Changho Choi, Chih-hung Chang, Shankar Krishnan, Terry J. Hendricks, Ward TeGrotenhuis
Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 929-938, November 11–17, 2011
Paper No: IMECE2011-63776
DOI: https://doi.org/10.1115/IMECE2011-63776
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Topics: Heat transfer, Boiling, Ethanol, Flow (Dynamics), Water, Dynamics (Mechanics), Energy conversion, Microchannels, Nanomaterials, Nanostructures
Proceedings Papers

Enhancement of Pool Boiling Heat Transfer Using Nanostructured Surfaces on Aluminum and Copper

Terry J. Hendricks, Shankar Krishnan, Changho Choi, Chih-hung Chang, Brian Paul
Proc. ASME. IMECE2009, Volume 12: Micro and Nano Systems, Parts A and B, 1025-1033, November 13–19, 2009
Paper No: IMECE2009-13176
DOI: https://doi.org/10.1115/IMECE2009-13176
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Topics: Aluminum, Copper, Heat transfer, Pool boiling, Boiling, Critical heat flux, Heart failure, Atomic force microscopy, Flux (Metallurgy), Heat
Proceedings Papers

Analysis of an Annular-Geometry Thermoelectric Module (TEM)

Shankar Krishnan, Marc Hodes, Christopher Jones, Oana Malis
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 241-247, July 8–12, 2007
Paper No: IPACK2007-33763
DOI: https://doi.org/10.1115/IPACK2007-33763
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Topics: Geometry, Cooling, Heat conduction, Accounting, Boundary-value problems, Energy dissipation, Flow (Dynamics), Flux (Metallurgy), Heat, Heat transfer
Proceedings Papers

Analysis and Performance Comparison of Competing Desktop Cooling Technologies

Niru Kumari, Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1019-1027, July 8–12, 2007
Paper No: IPACK2007-33407
DOI: https://doi.org/10.1115/IPACK2007-33407
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Topics: Cooling, Energy dissipation, Heat, Heat sinks, Impingement cooling, Junctions, Metal foams, Microchannels, Pumps, Semiconductors (Materials)
Proceedings Papers

Towards a Thermal Moore’s Law

Shankar Krishnan, Suresh V. Garimella, Greg M. Chrysler, Ravi V. Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 591-603, July 17–22, 2005
Paper No: IPACK2005-73409
DOI: https://doi.org/10.1115/IPACK2005-73409
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Topics: Computers, Cooling, Design, Electrons, Energy dissipation, Heat, Heat sinks, Heat transfer, Leakage, Power density
Proceedings Papers

A Two-Temperature Model for Solid/Liquid Phase Change in Metal Foams

Shankar Krishnan, Jayathi Y. Murthy, Suresh V. Garimella
Proc. ASME. HT-FED2004, Volume 3, 609-619, July 11–15, 2004
Paper No: HT-FED2004-56337
DOI: https://doi.org/10.1115/HT-FED2004-56337
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Topics: Metal foams, Temperature, Melting, Darcy's law, Enthalpy, Equilibrium (Physics), Finite volume methods, Fluids, Heat transfer coefficients, Momentum
Proceedings Papers

Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

Shankar Krishnan, Suresh V. Garimella
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 363-374, July 6–11, 2003
Paper No: IPACK2003-35169
DOI: https://doi.org/10.1115/IPACK2003-35169
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Topics: Computer cooling, Copper, Electronics, Energy storage, Heat sinks, Phase change materials, Thermal management, Transients (Dynamics)
Proceedings Papers

A Two-Temperature Model for the Analysis of Passive Thermal Control Systems for Electronics

Shankar Krishnan, Jayathi Y. Murthy, Suresh V. Garimella
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 105-115, November 17–22, 2002
Paper No: IMECE2002-33335
DOI: https://doi.org/10.1115/IMECE2002-33335
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Topics: Control systems, Electronics, Temperature, Fluids, Flow (Dynamics), Heat, Phase change materials, Thermal conductivity, Equilibrium (Physics), Fillers (Materials)