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Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
https://doi.org/10.1115/IPACK2015-48553
View Paper titled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
Open the PDF for Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography in another window
Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Open the PDF for Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints in another window
Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89262
https://doi.org/10.1115/InterPACK2009-89262
View Paper titled, Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints
Open the PDF for Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders
Proceedings Papers

Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature

Hiroyuki Nakano, Yasuhiro Ejiri, Takao Mori, Toshihiko Sayama, Takeshi Takayanagi, Yoshiyuki Okamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 833-839, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89275
https://doi.org/10.1115/InterPACK2009-89275
View Paper titled, Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature
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Topics: Solder joints, Temperature, Tin, Creep, Fatigue cracks, Corners (Structural elements), Cycles, Finite element analysis, Finite element methods, Fracture (Materials)
Proceedings Papers

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

Toshihiko Sayama, Hiroyuki Tsuritani, Kentaro Uesugi, Akira Tsuchiyama, Tsukasa Nakano, Hideyuki Yasuda, Takeshi Takayanagi, Takao Mori
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1115-1121, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73083
https://doi.org/10.1115/IPACK2005-73083
View Paper titled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Joining, Reliability, Tin, Cycles, Density, Flip-chip
Proceedings Papers

Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints

Toshihiko Sayama, Takeshi Takayanagi, Yoshiaki Nagai, Takao Mori, Qiang Yu
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 749-756, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35096
https://doi.org/10.1115/IPACK2003-35096
View Paper titled, Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints
Open the PDF for Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints in another window
Topics: Fatigue cracks, Lead-free solders, Solder joints, Tin
Journal Articles

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

Hiroyuki Tsuritani, Toshihiko Sayama, Kentaro Uesugi, Takeshi Takayanagi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 434–439.
https://doi.org/10.1115/1.2804093
Published Online: May 2, 2007
View Article titled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
Open the PDF for Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography in another window
Topics: Cycles, Nondestructive evaluation, Solders, X-rays, Synchrotron radiation, Flip-chip devices, Tin, Reliability, Computerized tomography