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Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Tien-Yu Tom Lee, Ravi Sharma, André Peyre-Lavigne

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 339-345, November 16–21, 1997

Paper No: IMECE1997-1108

DOI: https://doi.org/10.1115/IMECE1997-1108

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Topics: Carbon monoxide, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

Design Analysis of an Electroless Plating Bath Using CFD Technique

Tien-Yu Tom Lee, Jong-Kai Lin

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 381-388, November 14–19, 1999

Paper No: IMECE1999-1095

DOI: https://doi.org/10.1115/IMECE1999-1095

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Topics: Computational fluid dynamics, Design, Electroless plating, Flow (Dynamics), Semiconductor wafers, Diffusers, Fluids, Momentum, Nickel, Plating

Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999

Paper No: IMECE1999-0924

DOI: https://doi.org/10.1115/IMECE1999-0924

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Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics

Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

Proceedings Papers

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

V. H. Adams, T.-Y. Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 151-162, November 11–16, 2001

Paper No: IMECE2001/HTD-24388

DOI: https://doi.org/10.1115/IMECE2001/HTD-24388

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Topics: Gallium arsenide, Wire, Design, Engineering simulation, Junctions, Printed circuit boards, Simulation, Thermal resistance, Epoxy adhesives, Epoxy resins

Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001

Paper No: IMECE2001/HTD-24389

DOI: https://doi.org/10.1115/IMECE2001/HTD-24389

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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software

Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000

Paper No: IMECE2000-1840

DOI: https://doi.org/10.1115/IMECE2000-1840

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Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction

Proceedings Papers

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Dave S. Mahadevan, Vern Hause, Tien-Yu Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 467-471, November 5–10, 2000

Paper No: IMECE2000-1842

DOI: https://doi.org/10.1115/IMECE2000-1842

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Topics: Bonding, Temperature, Wire, Stress, Elongation, Extruding, Strength (Materials)

Proceedings Papers

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

V. H. Adams, V. A. Chiriac, T.-Y. Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 433-442, November 5–10, 2000

Paper No: IMECE2000-1838

DOI: https://doi.org/10.1115/IMECE2000-1838

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Topics: Ball-Grid-Array packaging, Computational fluid dynamics, Cooling, Copper, Design, Energy dissipation, Engineering simulation, Flat heat pipes, Heat, Heat conduction

Proceedings Papers

Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications

V. H. Adams, T. Y. Tom Lee, J. V. Hause

Proc. ASME. IMECE2000, Manufacturing Engineering, 413-423, November 5–10, 2000

Paper No: IMECE2000-1836

DOI: https://doi.org/10.1115/IMECE2000-1836

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Topics: Gallium arsenide, Printed circuit boards, Thermal conductivity, Approximation, Cooling, Energy dissipation, Heat, Heat conduction, Heat flux, Heat transfer

Proceedings Papers

Design Considerations in the Development of a North American High Speed Turnout

Brian C. Abbott, Tom Lee, Gary Click, Steve Mattson, Ken W. Ouelette

Proc. ASME. JRC2010, 2010 Joint Rail Conference, Volume 1, 219-227, April 27–29, 2010

Paper No: JRC2010-36126

DOI: https://doi.org/10.1115/JRC2010-36126

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Topics: Design, Stress, High speed rail, Safety, Automotive design, Gages, Kinematics, Maintenance, Modeling, Optimization

Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007

Paper No: IPACK2007-33335

DOI: https://doi.org/10.1115/IPACK2007-33335

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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation

Proceedings Papers

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007

Paper No: IPACK2007-33705

DOI: https://doi.org/10.1115/IPACK2007-33705

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Topics: Computer simulation, Heat, Performance evaluation, Transients (Dynamics), Cycles, Heat budget (Physics), Signals, Copper, Design, Dynamic systems

Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007

Paper No: IPACK2007-33707

DOI: https://doi.org/10.1115/IPACK2007-33707

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Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry

Proceedings Papers

Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications

Tien-Yu Tom Lee, Victor A. Chiriac

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 671-677, July 8–12, 2007

Paper No: IPACK2007-33844

DOI: https://doi.org/10.1115/IPACK2007-33844

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Topics: Gallium arsenide, Wire, Flip-chip, Flip-chip devices, Simulation, Design, Heat, Heat transfer, Solders, Vehicles

Proceedings Papers

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

Victor Chiriac, Tom Lee, Arvind Krishna, Venkata Krishnan, Rodney Lawrence

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005

Paper No: IPACK2005-73101

DOI: https://doi.org/10.1115/IPACK2005-73101

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Topics: Automotive industry, Boundary-value problems, Computer cooling, Design, Electrical conductivity, Modeling, Simulation, Steady state, Temperature, Thermal analysis

Proceedings Papers

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

Tien-Yu Tom Lee, Victor A. Chiriac, Roger Stout

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 105-112, July 17–22, 2005

Paper No: IPACK2005-73090

DOI: https://doi.org/10.1115/IPACK2005-73090

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Topics: Telecommunications, Transients (Dynamics), Cycles, Steady state, Temperature, Waves, Junctions, Capacitors, Computation, Computer software

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Journal citation

NARROW

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Design Analysis of an Electroless Plating Bath Using CFD Technique

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Mechanical Characterization of Gold Bonding Wires With Different Doping at Extreme Temperatures

Thermal Assessment and Enhancement of Molded Array (MAP) PBGA Packages for Handheld Telecommunication Applications

Thermal Evaluation of GaAs-Based RF Power Amplifier Packages for Handheld Portable Applications

Design Considerations in the Development of a North American High Speed Turnout

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Thermal Performance Evaluation and Enhancement for an Automotive Wireless Application Incorporating Multiple Dynamic Heat Sources

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Thermal Investigation of Interconnect Technologies for GaAs RF Power Amplifier in Handheld Applications

System Level Considerations in the Incorporation of a Component Thermal Model for an Automotive Application

A Conjugate Numerical-RC Network Prediction of the Transient Thermal Response of a Power Amplifier Module in Handheld Telecommunication

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