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Journal Articles

Cryo-Assisted Extrusion Three-Dimensional Printing of Shape Memory Polymer–Graphene Composites

Adeyinka Idowu, Tony Thomas, Benjamin Boesl, Arvind Agarwal
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2023, 145(4): 041003.
Paper No: MANU-21-1636
DOI: https://doi.org/10.1115/1.4056170
Published Online: December 12, 2022
View Article titled, Cryo-Assisted Extrusion Three-Dimensional Printing of Shape Memory Polymer–Graphene Composites
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Includes: Supplementary data
Journal Articles

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021111.
Paper No: EP-21-1067
DOI: https://doi.org/10.1115/1.4052630
Published Online: December 1, 2021
View Article titled, Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads
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Topics: Failure, Service life (Equipment), Signals, Temperature, Vibration, Principal component analysis
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Paper No: IPACK2021-74074
DOI: https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021
Paper No: IPACK2021-74066
DOI: https://doi.org/10.1115/IPACK2021-74066
View Paper titled, Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning
Open the PDF for Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning in another window
Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance
Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Paper No: IPACK2021-74570
DOI: https://doi.org/10.1115/IPACK2021-74570
View Paper titled, Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress
Proceedings Papers

Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 27–29, 2020
Paper No: IPACK2020-2679
DOI: https://doi.org/10.1115/IPACK2020-2679
View Paper titled, Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads
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Topics: Alloys, Stress, Temperature, Vibration
Journal Articles

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011011.
Paper No: EP-20-1039
DOI: https://doi.org/10.1115/1.4047577
Published Online: July 23, 2020
View Article titled, Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
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Topics: Signals, Vibration
Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
DOI: https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Article titled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019
Paper No: IPACK2019-6580
DOI: https://doi.org/10.1115/IPACK2019-6580
View Paper titled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements
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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing
Proceedings Papers

Health Monitoring of PCB’s Under Mechanical Shock Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A028, October 7–9, 2019
Paper No: IPACK2019-6578
DOI: https://doi.org/10.1115/IPACK2019-6578
View Paper titled, Health Monitoring of PCB’s Under Mechanical Shock Loads
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Topics: Shock (Mechanics), Stress, Signals, Failure, Damping, Statistical analysis, Strain gages, Strain measurement
Proceedings Papers

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 27–30, 2018
Paper No: IPACK2018-8356
DOI: https://doi.org/10.1115/IPACK2018-8356
View Paper titled, Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration
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Topics: Damage assessment, Electronics, Temperature, Vibration, Damage, Failure, Signals, Safety, High temperature, Principal component analysis
Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017
Paper No: IPACK2017-74239
DOI: https://doi.org/10.1115/IPACK2017-74239
View Paper titled, PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
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Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration