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Proceedings Papers

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 163-170, November 11–16, 2001

Paper No: IMECE2001/HTD-24389

DOI: https://doi.org/10.1115/IMECE2001/HTD-24389

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Topics: Design, Optical interconnections, Vacuum, Temperature, Ceramics, Lumber, Copper, Manufacturing, Cavities, Computer software

Proceedings Papers

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien -Yu Tom Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 93-100, November 11–16, 2001

Paper No: IMECE2001/HTD-24382

DOI: https://doi.org/10.1115/IMECE2001/HTD-24382

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Topics: Design, Gallium arsenide, Temperature, Thermal conductivity, Metals, Computer simulation, Junctions, Microelectronic devices, Packaging, Reliability

Proceedings Papers

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien -Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 81-89, November 11–16, 2001

Paper No: IMECE2001/HTD-24381

DOI: https://doi.org/10.1115/IMECE2001/HTD-24381

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Topics: Air jets, Cooling, Microelectronic devices, Heat transfer, Channel flow, Flow (Dynamics), High temperature, Reynolds number, Buckling, Engineering simulation

Proceedings Papers

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2000, Manufacturing Engineering, 453-459, November 5–10, 2000

Paper No: IMECE2000-1840

DOI: https://doi.org/10.1115/IMECE2000-1840

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Topics: Anisotropy, Manufacturing, Thermal analysis, Transients (Dynamics), Temperature, Computational fluid dynamics, Hardening (Curing), Convection, Cooling, Heat conduction

Proceedings Papers

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 357-365, July 6–8, 2011

Paper No: IPACK2011-52262

DOI: https://doi.org/10.1115/IPACK2011-52262

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Topics: Air jets, Cooling, Jets, Microelectronic devices

Proceedings Papers

Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

Victor Adrian Chiriac

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 769-776, July 19–23, 2009

Paper No: InterPACK2009-89111

DOI: https://doi.org/10.1115/InterPACK2009-89111

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Topics: Cooling, Fans, Heat pipes, Heat sinks, Microelectronic devices

Proceedings Papers

A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

Victor Adrian Chiriac, Jorge Luis Rosales

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 811-818, July 8–12, 2007

Paper No: IPACK2007-33708

DOI: https://doi.org/10.1115/IPACK2007-33708

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Topics: Air jets, Buckling, Cooling, Dimensions, Engineering simulation, Flow (Dynamics), Heat, Heat transfer, Jets, Microelectronic devices

Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007

Paper No: IPACK2007-33335

DOI: https://doi.org/10.1115/IPACK2007-33335

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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation

Proceedings Papers

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee, H. S. Chen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 435-442, July 6–11, 2003

Paper No: IPACK2003-35213

DOI: https://doi.org/10.1115/IPACK2003-35213

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Topics: Microelectronic devices, Optimization, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Computer software, Cooling, Flow (Dynamics)

Proceedings Papers

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, David Lutz

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 443-450, July 6–11, 2003

Paper No: IPACK2003-35216

DOI: https://doi.org/10.1115/IPACK2003-35216

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Topics: Optimization, Temperature, Elastomers, Design, Slug flows, Computer software, Copper, Failure, High temperature, Numerical analysis

Proceedings Papers

Thermal Assessment of a Power Amplifier Module in Wireless Handsets

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 161-168, November 17–22, 2002

Paper No: IMECE2002-39179

DOI: https://doi.org/10.1115/IMECE2002-39179

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Topics: Computer simulation, Computer software, Copper, Design, Errors, Heat, Heat sinks, Numerical analysis, Optimization, Packaging

Proceedings Papers

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Victor Adrian Chiriac, Tien-Yu Tom Lee, Jorge Luis Rosales

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 171-178, November 17–22, 2002

Paper No: IMECE2002-39243

DOI: https://doi.org/10.1115/IMECE2002-39243

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Topics: Air jets, Cooling, Heat transfer, Jets, Flow (Dynamics), Temperature, Flat heat pipes, Heat sinks, Manufacturing, Microelectronic devices

Proceedings Papers

Control of Convective Heat Transfer in a Confined Laminar Impinging Jet by Low Amplitude Forcing

Victor Adrian Chiriac, Alfonso Ortega

Proc. ASME. IMECE2002, Heat Transfer, Volume 1, 31-39, November 17–22, 2002

Paper No: IMECE2002-32909

DOI: https://doi.org/10.1115/IMECE2002-32909

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Topics: Air jets, Buckling, Convection, Cooling, Excitation, Flow (Dynamics), Heat transfer, Nozzles, Reynolds number, Separation (Technology)

Proceedings Papers

Board-Side Boundary Condition for a Single Component on a PCB in Forced Convection

Sriram Neelakantan, Victor Adrian Chiriac

Proc. ASME. IMECE2002, Heat Transfer, Volume 2, 115-120, November 17–22, 2002

Paper No: IMECE2002-33731

DOI: https://doi.org/10.1115/IMECE2002-33731

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Topics: Boundary-value problems, Forced convection, Computational fluid dynamics, Junctions, Simulation, Temperature, Computational methods, Heat transfer coefficients, Air flow, Copper

Proceedings Papers

Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver

Victor Adrian Chiriac, Tien-Yu Tom Lee, Paul Bennett

Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 181-188, November 17–22, 2002

Paper No: IMECE2002-39531

DOI: https://doi.org/10.1115/IMECE2002-39531

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Topics: Airbags, Circuits, Transients (Dynamics), Temperature, Boundary-value problems, Junctions, Computer software, Energy dissipation, Engineering simulation, Heat

Proceedings Papers

The Unsteady Characteristics of a Laminar Flow and Heat Transfer of a Pair of Confined Impinging Air Jets

Victor Adrian Chiriac, Jorge Luis Rosales

Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 219-225, November 15–21, 2003

Paper No: IMECE2003-42142

DOI: https://doi.org/10.1115/IMECE2003-42142

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Topics: Air jets, Heat transfer, Laminar flow, Heat, Flow (Dynamics), Jets, Bubbles, Heat transfer coefficients, Cooling, Dimensions

Proceedings Papers

Thermal Performance Optimization of RF Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 227-233, November 15–21, 2003

Paper No: IMECE2003-42171

DOI: https://doi.org/10.1115/IMECE2003-42171

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Topics: Optimization, Temperature, Junctions, Thermal resistance, Solders, Computer simulation, Design, Electrical conductivity, Epoxy adhesives, Epoxy resins

Proceedings Papers

Transient Thermal Evaluation for Integrated Motor Control System With Multiple Dynamic Heat Sources

Victor Adrian Chiriac, Tien-Yu Lee, David Bien

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 447-453, November 15–21, 2003

Paper No: IMECE2003-42050

DOI: https://doi.org/10.1115/IMECE2003-42050

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Topics: Heat, Motor controls, Transients (Dynamics), Temperature, Junctions, Motors, Thermal resistance, Approximation, Boundary-value problems, Computer simulation

Proceedings Papers

Thermal Assessment of Cooling System Incorporating Heat Sink and Embedded Heat Pipes for Testing High Power Microelectronics

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2005, Heat Transfer, Part A, 767-774, November 5–11, 2005

Paper No: IMECE2005-81794

DOI: https://doi.org/10.1115/IMECE2005-81794

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Topics: Cooling systems, Fans, Heat pipes, Heat sinks, Microelectronic devices, Testing

Proceedings Papers

System Level Thermal Performance Evaluation of New Inverted Exposed Pad Packages for Automotive Applications

Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 207-212, November 5–10, 2006

Paper No: IMECE2006-14722

DOI: https://doi.org/10.1115/IMECE2006-14722

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Topics: Automotive industry, Performance evaluation, Junctions, Temperature, Copper alloys, Design, Thermal resistance, Computational fluid dynamics, Epoxy adhesives, Epoxy resins

Journal citation

NARROW

Thermal Design Analysis of Free Space Optical Interconnect (FSOI) Package Module

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

A Novel Cooling Enhancement in Microelectronic Devices and Systems Using Oscillatory Impinging Air Jets

Transient Thermal Analysis of an Anisotropic Conductive Film Package Assembly Process

The Microelectronics Cooling Impact and Comparison of 2D and 3D Unsteady Effects of a Pair of Opposed Confined Angled Impinging Air Jets

Advanced Cooling With Embedded Heat Pipes for High Power Microelectronics

A Numerical Comparison of 2D and 3D Unsteady Confined Impinging Air Jets and Associated Microelectronics Cooling Impact

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

Thermal Assessment of a Power Amplifier Module in Wireless Handsets

Microelectronic Cooling Techniques Using Single and Dual Oscillatory Impinging Air Jets

Control of Convective Heat Transfer in a Confined Laminar Impinging Jet by Low Amplitude Forcing

Board-Side Boundary Condition for a Single Component on a PCB in Forced Convection

Transient Thermal Investigation for a SmartMOS Based Airbag Circuit Driver

The Unsteady Characteristics of a Laminar Flow and Heat Transfer of a Pair of Confined Impinging Air Jets

Thermal Performance Optimization of RF Packages for Wireless Communication

Transient Thermal Evaluation for Integrated Motor Control System With Multiple Dynamic Heat Sources

Thermal Assessment of Cooling System Incorporating Heat Sink and Embedded Heat Pipes for Testing High Power Microelectronics

System Level Thermal Performance Evaluation of New Inverted Exposed Pad Packages for Automotive Applications

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