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Yaman Manaserh
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Proceedings Papers

Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 25–27, 2022
Paper No: IPACK2022-97386
DOI: https://doi.org/10.1115/IPACK2022-97386
View Paper titled, Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
Click here to open pdf in another window PDF for Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors

Ali Heydari, Yaman Manaserh, Ahmad Abubakar, Carol Caceres, Harold Miyamura, Alfonso Ortega, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 25–27, 2022
Paper No: IPACK2022-97047
DOI: https://doi.org/10.1115/IPACK2022-97047
View Paper titled, Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors
Click here to open pdf in another window PDF for Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors
Topics: Cooling, Heat flux
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Paper No: IPACK2020-2627
DOI: https://doi.org/10.1115/IPACK2020-2627
View Paper titled, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
Click here to open pdf in another window PDF for Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance