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Yueli Liu
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Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35318
https://doi.org/10.1115/IPACK2003-35318
View Paper titled, Drop Reliability of Corner Bonded CSP in Portable Products
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Dhananjay Panchgade, Jeffrey Suhling, Larry Crane
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 135-143, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42075
https://doi.org/10.1115/IMECE2003-42075
View Paper titled, Drop-Impact Reliability of Chip-Scale Packages in Handheld Products
Open the PDF for Drop-Impact Reliability of Chip-Scale Packages in Handheld Products in another window
Topics: Reliability, Corners (Structural elements), Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 425-433, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62317
https://doi.org/10.1115/IMECE2004-62317
View Paper titled, Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact
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Topics: Ball-Grid-Array packaging, Data acquisition systems, Deformation, Dynamics (Mechanics), Electronic products, Errors, Failure, Finite element model, Kinematics, Modeling
Journal Articles

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
https://doi.org/10.1115/1.2804085
Published Online: March 25, 2007
View Article titled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
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Topics: Ball-Grid-Array packaging, Displacement, Errors, Finite element model, Reliability, Shells, Shock (Mechanics), Transients (Dynamics), Dynamics (Mechanics), Modeling