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Proceedings Papers

Application of the ASME Code to Radioactive Material Packaging/Cask: Lessons Learned From the 2014 DOE Training Course

Zenghu Han, Ralph Fabian, Ron Pope, Yung Liu, James Shuler
Proc. ASME. PVP2015, Volume 7: Operations, Applications and Components, V007T07A054, July 19–23, 2015
Paper No: PVP2015-45955
DOI: https://doi.org/10.1115/PVP2015-45955
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Topics: ASME Standards, Packaging, Radioactive substances, Storage, Transportation systems, Design, Testing, Containment, Fuels, Manufacturing
Proceedings Papers

Extending Periodic Leakage Rate Testing of 9977 Packages With Elastomeric O-Rings

Zenghu Han, Vikram N. Shah, Yung Y. Liu
Proc. ASME. PVP2014, Volume 7: Operations, Applications and Components, V007T07A027, July 20–24, 2014
Paper No: PVP2014-28950
DOI: https://doi.org/10.1115/PVP2014-28950
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Topics: Leakage, Seals, Testing, Temperature, Storage, Transport packages, Containment, Design, Radiation (Physics), Radioactive substances
Proceedings Papers

Dynamic Finite Element Analysis of Drum-Type Shipping Packages for Radioactive Materials

Zenghu Han, Vikram N. Shah, Yung Y. Liu
Proc. ASME. PVP2012, Volume 7: Operations, Applications and Components, 281-287, July 15–19, 2012
Paper No: PVP2012-78707
DOI: https://doi.org/10.1115/PVP2012-78707
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Topics: Finite element analysis, Radioactive substances, Damage, Temperature, Corners (Structural elements), Fire, Regulations, Testing, Water, Accidents
Proceedings Papers

Dynamic Structural Analysis of the Model 9979 Type AF Shipping Packaging

Zenghu Han, Vikram N. Shah, Yung Y. Liu
Proc. ASME. PVP2011, Volume 7: Operations, Applications, and Components, 381-386, July 17–21, 2011
Paper No: PVP2011-57688
DOI: https://doi.org/10.1115/PVP2011-57688
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Topics: Packaging, Structural analysis, Accidents, Corners (Structural elements), Damage, Deformation, Engineering prototypes, Finite element analysis, Regulations, Rivers
Proceedings Papers

Dynamic Structural Analysis of the 9516 Transport Package

Zenghu Han, Vikram N. Shah, Jeries Abou-Hanna, Yung Y. Liu
Proc. ASME. PVP2010, ASME 2010 Pressure Vessels and Piping Conference: Volume 7, 407-414, July 18–22, 2010
Paper No: PVP2010-25047
DOI: https://doi.org/10.1115/PVP2010-25047
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Topics: Accidents, ASME Boiler and Pressure Vessel Code, Bearings, Computers, Containment vessels, Cushioning materials, Finite element analysis, Mechanical engineering, Model validation, Steel
Proceedings Papers

Phase-Change Nanofluids With Enhanced Thermophysical Properties

Zenghu Han, Bao Yang, Yung Y. Liu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 1, 441-447, December 18–21, 2009
Paper No: MNHMT2009-18148
DOI: https://doi.org/10.1115/MNHMT2009-18148
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Topics: Heat capacity, Nanofluids, Thermal conductivity
Proceedings Papers

Natural Convective Heat Transfer of Water-in-FC72 Nanoemulsion Fluids

Zenghu Han, Bao Yang
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 611-614, June 6–9, 2008
Paper No: MNHT2008-52351
DOI: https://doi.org/10.1115/MNHT2008-52351
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Topics: Convection, Fluids, Water, Thermal conductivity, Viscosity, Disperse systems, Nanofluids, Nanoparticles, Particulate matter
Proceedings Papers

Nanofluids Containing Hybrid Sphere/Carbon Nanotube Particles

Zenghu Han, Bao Yang, S. H. Kim, M. R. Zachariah
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 861-864, January 10–13, 2007
Paper No: MNC2007-21331
DOI: https://doi.org/10.1115/MNC2007-21331
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Topics: Carbon nanotubes, Nanofluids, Particulate matter, Fluids, Nanoparticles, Thermal conductivity, Temperature, Contact resistance, Fibers, Heat
Proceedings Papers

A New Type of Nanoengineered Heat Transfer Fluids: Nanoemulsion Fluids

Bao Yang, Zenghu Han
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 333-336, November 5–10, 2006
Paper No: IMECE2006-14031
DOI: https://doi.org/10.1115/IMECE2006-14031
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Topics: Fluids, Heat transfer, Thermal conductivity, Water, Microelectronic devices, Nanoparticles, Optoelectronic devices, Particulate matter, Stability, Thermal management