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Journal Articles

Numerical Optimization of Key Design Parameters of a Thermoelectric Microfluidic Sensor for Ultrasensitive Detection of Biochemical Analytes

Saif Mohammad Ishraq Bari, Louis G. Reis, Gergana G. Nestorova
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2021, 13(2): 021024.
Paper No: TSEA-20-1241
DOI: https://doi.org/10.1115/1.4047826
Published Online: August 10, 2020
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Topics: Computer simulation, Design, Flow (Dynamics), Fluids, Glass, Glucose, Heat, Heat sinks, Junctions, Microfluidics
Includes: Supplementary data
Journal Articles

Thermally Mediated Double Emulsion Breakup in Bifurcating Bi-Layer Microchannel

Yong Ren, Yue Chan, Can Yang, Jing Wang
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2020, 12(6): 061005.
Paper No: TSEA-19-1543
DOI: https://doi.org/10.1115/1.4046608
Published Online: June 18, 2020
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Topics: Drops, Emulsions, Junctions, Microchannels, Surface tension, Water, Temperature, Flow (Dynamics), Shells, Dynamics (Mechanics)
Journal Articles

Slug Formation Analysis of Liquid–Liquid Two-Phase Flow in T-Junction Microchannels

Jin-yuan Qian, Xiao-juan Li, Zan Wu, Zhi-jiang Jin, Junhui Zhang, Bengt Sunden
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. October 2019, 11(5): 051017.
Paper No: TSEA-18-1347
DOI: https://doi.org/10.1115/1.4043385
Published Online: July 18, 2019
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Topics: Microchannels, Slug flows, Two-phase flow, Junctions, Flow (Dynamics)
Journal Articles

Efficient Thermal-Impedance Simulation of Insulated-Gate Bipolar Transistors Modules on Heat Sinks

Thomas B. Gradinger, Uwe Drofenik
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2013, 5(4): 041009.
Paper No: TSEA-12-1128
DOI: https://doi.org/10.1115/1.4023889
Published Online: October 3, 2013
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Topics: Heat sinks, Simulation, Temperature, Junctions, Gates (Closures), Transistors, Errors
Journal Articles

Development of Compact Thermal–Fluid Models at the Electronic Equipment Level

Jason Stafford, Ronan Grimes, David Newport
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2012, 4(3): 031007.
DOI: https://doi.org/10.1115/1.4006715
Published Online: July 16, 2012
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Topics: Boundary-value problems, Computational fluid dynamics, Design, Electronic equipment, Electronics, Flow (Dynamics), Heat, Modeling, Optimization, Temperature
Journal Articles

Green Cooling of High Performance Microprocessors: Parametric Study Between Flow Boiling and Water Cooling

Jonathan A. Olivier, Jackson B. Marcinichen, Arnaud Bruch, John Thome
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041003.
DOI: https://doi.org/10.1115/1.4004435
Published Online: October 24, 2011
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Topics: Cooling, Flow (Dynamics), Fluids, Heat, Heat flux, Refrigerants, Temperature, Water, Exergy, Flux (Metallurgy)
Journal Articles

Vapor Chamber Acting as a Heat Spreader for Power Module Cooling

Y. P. Zhang, X. L. Yu, Q. K. Feng, L. H. Zhang
Journal: Journal of Thermal Science and Engineering Applications
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
DOI: https://doi.org/10.1115/1.4000285
Published Online: November 4, 2009
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Topics: Cooling, Copper, Flat heat pipes, Heat, Heat sinks, Junctions, Temperature, Thermal resistance, Vapors, Heat flux