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Keywords: liquid cooling
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2021, 13(3): 034501.
Paper No: TSEA-20-1251
Published Online: September 18, 2020
... will be significantly decreased if the heat released by the electronic chips can be reduced directly. Although liquid cooling heat sinks (LCHS) have been demonstrated as an effective way to resolve this problem, the application of LCHS is limited by the uneven cooling distribution on the surface of the electronic chips...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2019, 11(3): 034501.
Paper No: TSEA-17-1462
Published Online: January 29, 2019
...Özgür Atik; Hakan Ertürk Cooling performance enhancement of computer liquid cooling (LC) systems using hexagonal boron nitride (hBN)–water nanofluids is investigated experimentally. Particle volume fractions of 0.1–2% are considered at constant flow rates varying from 0.3 to 2 L/min for two...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031004.
Paper No: TSEA-12-1033
Published Online: June 24, 2013
... Impinging, Submerged and Confined Water Jet ,” ASME J. Therm. Sci. Eng. Appl. , 1 ( 3 ), p. 031001 . 10.1115/1.4000564 [7] Incropera , F. P. , 1999 , Liquid Cooling of Electronic Devices by Single-Phase Convection , John Wiley & Sons, Inc. , New York. [8] Ekkad , S. V...
Journal Articles