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Journal Articles

Thermodynamics Model for Stribeck Curve and Experiments: The Role of Interfacial Interaction

Xiangjun Zhang, Haoda Jing, Yu Tian, Yonggang Meng
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. August 2020, 142(8): 081801.
Paper No: TRIB-19-1276
https://doi.org/10.1115/1.4046410
Published Online: March 25, 2020
View Article titled, Thermodynamics Model for Stribeck Curve and Experiments: The Role of Interfacial Interaction
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Topics: Entropy, Film thickness, Friction, Industrial lubrication systems, Lubricants, Lubrication, Thermodynamics, Semiconductor wafers, Viscosity, Pressure
Journal Articles

Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing

Jianguo Xin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2010, 132(4): 041605.
https://doi.org/10.1115/1.4002108
Published Online: October 7, 2010
View Article titled, Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing
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Topics: Evaporation, Flow (Dynamics), Polishing, Semiconductor wafers, Slurries, Microfluidics
Journal Articles

Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities

Kurt Beschorner, C. Fred Higgs, III, Michael Lovell
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. July 2009, 131(3): 034501.
https://doi.org/10.1115/1.3118783
Published Online: May 22, 2009
View Article titled, Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities
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Topics: Disks, Navier-Stokes equations, Polishing, Pressure, Semiconductor wafers
Journal Articles

A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing

Elon J. Terrell, C. Fred Higgs, III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 2009, 131(1): 012201.
https://doi.org/10.1115/1.2991173
Published Online: December 2, 2008
View Article titled, A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing
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Topics: Modeling, Particulate matter, Polishing, Semiconductor wafers, Simulation, Wear, Lubrication, Slurries, Contact mechanics, Particle dynamics
Journal Articles

Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning

Dedy Ng, Hong Liang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. April 2008, 130(2): 021603.
https://doi.org/10.1115/1.2908896
Published Online: May 7, 2008
View Article titled, Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning
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Topics: Adhesion, Drag (Fluid dynamics), Fluids, Friction, Lubrication, Particulate matter, Polishing, Semiconductor wafers, Van der Waals forces, Pressure
Journal Articles

A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing

Elon J. Terrell, C. Fred Higgs III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2007, 129(4): 933–941.
https://doi.org/10.1115/1.2768614
Published Online: April 18, 2007
View Article titled, A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing
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Topics: Particulate matter, Semiconductor wafers, Simulation, Slurries, Modeling, Polishing, Flow (Dynamics)
Journal Articles

On the CMP Material Removal at the Molecular Scale

L. Chang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. April 2007, 129(2): 436–437.
https://doi.org/10.1115/1.2647829
Published Online: November 13, 2006
View Article titled, On the CMP Material Removal at the Molecular Scale
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Topics: Chemistry, Particulate matter, Polishing, Semiconductor wafers, Slurries, Semiconductors (Materials)
Journal Articles

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves

Jen Fin Lin, Sheng-Chao Chen, Yu Long Ouyang, Ming Shih Tsai
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2006, 128(3): 445–459.
https://doi.org/10.1115/1.2194913
Published Online: March 8, 2006
View Article titled, Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves
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Topics: Copper, Polishing, Pressure, Semiconductor wafers, Lubrication, Surface roughness, Slurries, Abrasives, Particulate matter
Journal Articles

Revisiting the Removal Rate Model for Oxide CMP

Jamshid Sorooshian, Leonard Borucki, David Stein, Robert Timon, Dale Hetherington, Ara Philipossian
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2005, 127(3): 639–651.
https://doi.org/10.1115/1.1866168
Published Online: June 13, 2005
View Article titled, Revisiting the Removal Rate Model for Oxide CMP
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Topics: Heating, Photovoltaics, Polishing, Pressure, Semiconductor wafers, Temperature, Slurries, Electromagnetic scattering, Silicon
Journal Articles

A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

Yeau-Ren Jeng, Pay-Yau Huang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 190–197.
https://doi.org/10.1115/1.1828068
Published Online: February 7, 2005
View Article titled, A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing
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Topics: Particulate matter, Polishing, Semiconductor wafers, Slurries, Particle size
Journal Articles

Tilt and Interfacial Fluid Pressure Measurements of a Disk Sliding on a Polymeric Pad

Sum Huan Ng, Len Borucki, C. Fred Higgs, III, Inho Yoon, Andre´s Osorno, Steven Danyluk
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2005, 127(1): 198–205.
https://doi.org/10.1115/1.1829718
Published Online: February 7, 2005
View Article titled, Tilt and Interfacial Fluid Pressure Measurements of a Disk Sliding on a Polymeric Pad
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Topics: Disks, Fluid pressure, Pressure, Semiconductor wafers, Stress, Polishing
Journal Articles

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers

Jen Fin Lin, Professor, Junne Dar Chern, Yang Hui Chang, Ping Lin Kuo, Ming Shih Tsai
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2004, 126(1): 185–199.
https://doi.org/10.1115/1.1631010
Published Online: January 13, 2004
View Article titled, Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers
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Topics: Copper, Semiconductor wafers, Pressure, Composite materials, Deformation, Polishing, Young's modulus
Journal Articles

Mechanism for Subambient Interfacial Pressures While Polishing With Liquids

Joseph A. Levert, Steven Danyluk, John Tichy
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2000, 122(2): 450–457.
https://doi.org/10.1115/1.555381
Published Online: August 24, 1999
View Article titled, Mechanism for Subambient Interfacial Pressures While Polishing With Liquids
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Topics: Modeling, Pressure, Semiconductor wafers, Polishing, Stress, Compression
Journal Articles

Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis

M. Bhagavat, V. Prasad, I. Kao
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2000, 122(2): 394–404.
https://doi.org/10.1115/1.555375
Published Online: July 19, 1999
View Article titled, Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
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Topics: Cutting, Film thickness, Finite element analysis, Pressure, Semiconductor wafers, Slurries, Viscosity, Wire, Abrasives, Hydrodynamics
Journal Articles

The Effect of Asperity Array Geometry on Friction and Pull-Off Force

Yasuhisa Ando, Jiro Ino
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 1997, 119(4): 781–787.
https://doi.org/10.1115/1.2833885
Published Online: October 1, 1997
View Article titled, The Effect of Asperity Array Geometry on Friction and Pull-Off Force
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Topics: Friction, Geometry, Silicon, Atomic force microscopy, Platinum, Probes, Focused ion beams, Semiconductor wafers
Journal Articles

Dependence of Nano-Friction and Nano-Wear on Loading Force for Sharp Diamond Tips Sliding on Si, Mn-Zn Ferrite, and Au

Zhaoguo Jiang, C.-J. Lu, D. B. Bogy, T. Miyamoto
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. April 1995, 117(2): 328–333.
https://doi.org/10.1115/1.2831251
Published Online: April 1, 1995
View Article titled, Dependence of Nano-Friction and Nano-Wear on Loading Force for Sharp Diamond Tips Sliding on Si, Mn-Zn Ferrite, and Au
Open the PDF for Dependence of Nano-Friction and Nano-Wear on Loading Force for Sharp Diamond Tips Sliding on Si, Mn-Zn Ferrite, and Au in another window
Topics: Diamonds, Ferrites (Magnetic materials), Friction, Wear, Stress, Scanning probe microscopy, Semiconductor wafers, Tribology
Journal Articles

Interaction Force Between Thin Film Disk Media and Elastic Solids Investigated by Atomic Force Microscope

T. Miyamoto, R. Kaneko, Y. Ando
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 1990, 112(3): 567–572.
https://doi.org/10.1115/1.2920294
Published Online: July 1, 1990
View Article titled, Interaction Force Between Thin Film Disk Media and Elastic Solids Investigated by Atomic Force Microscope
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Topics: Atomic force microscopy, Disks, Solids, Thin films, Lubricants, Crystals, Stiction, Tungsten, Semiconductor wafers, Silicon
Journal Articles

Development of a Three-Dimensional Noncontact Digital Optical Profiler

J. C. Wyant, C. L. Koliopoulos, B. Bhushan, D. Basila
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 1986, 108(1): 1–8.
https://doi.org/10.1115/1.3261137
Published Online: January 1, 1986
View Article titled, Development of a Three-Dimensional Noncontact Digital Optical Profiler
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Topics: Computers, Disks, Glass, Interferometers, Magnetic heads, Microscopes, Piezoelectric transducers, Reflection, Semiconductor wafers, Sensors