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Keywords: thermal expansion
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Journal Articles
Publisher: ASME
Article Type: Friction And Wear
J. Tribol. January 2012, 134(1): 011603.
Published Online: February 24, 2012
.... , Lograsso , T. A. , and Schlagel , D. L. , 2002 , “ Thermal Expansion of Single-Crystal Gd 5 (Si 1.95 Ge 2.05 ) Showing Unusual First-Order Transformation ,” IEEE Trans. Magn. , 38 ( 5 ), pp. 3252 – 3254 . 10.1109/TMAG.2002.802508 17 Han , M. , Jiles , D. C. , Snyder , J. E...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2009, 131(4): 041703.
Published Online: September 22, 2009
... provides a controllable heat source and thermocouples record the temperatures on the shaft and GFB housing. For increasing shaft temperatures (up to 188 ° C ), increasing static loads (0–133 N) are applied to the bearing and its deflection recorded. In the test configuration, thermal expansion of the GFB...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2004, 126(2): 353–359.
Published Online: April 19, 2004
... and thrust bearing of a HDB spindle motor is very small, i.e., less than 10 μm. The elevated temperature may change the clearance due to the different thermal expansion coefficients of shaft and sleeve. The change of clearance may affect the characteristics of hydrodynamic bearing significantly in the HDB...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. January 2004, 126(1): 50–55.
Published Online: January 13, 2004
...J. Y. Jang; M. M. Khonsari Thermoelastic instability (TEI) is known to be directly related to the occurrence of hot spots in friction systems, such as brakes, seals, and clutches. TEI is a failure process where the local frictional heat, thermal expansion, contacting pressure and temperature grow...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2003, 125(4): 833–841.
Published Online: September 25, 2003
... coefficient and thermal expansion coefficient are performed to gain insight into the phenomenon of TIS. A statistical procedure is applied to the simulated results and an empirical relationship is derived. Good agreement between the empirical and published results attests to the capability of the model...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2003, 125(2): 364–376.
Published Online: March 19, 2003
... that cupping moves in the positive direction for an increase in the substrate’s Young’s modulus in the transverse direction for MP and ME tapes. An analytical model demonstrates that increases in temperature and front coat thermal expansion coefficient leads to cupping movement in the negative direction...
Topics: Stress, Tension
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2001, 123(2): 380–387.
Published Online: June 16, 2000
...B. K. Gupta; Kenneth Young; Sameera K. Chilamakuri; Aric K. Menon The magnetic/mechanical spacing between the transducer and the disk significantly decreases due to thermal expansion of pole tips at stressed high temperature and high humidity tests. The protruded pole tips and alumina overcoat can...
Journal Articles